共 50 条
[41]
Simplified 3-D FE simulation of rotary piercing controlling rotation of plug
[J].
SIMULATION OF MATERIALS PROCESSING: THEORY, METHODS AND APPLICATIONS,
2001,
:577-582
[42]
THERMAL CONTACT SIMULATION IN 2-D AND 3-D MECHANISMS
[J].
JOURNAL OF TRIBOLOGY-TRANSACTIONS OF THE ASME,
1988, 110 (02)
:247-252
[43]
A study of electromigration in 3-D flip chip solder joint using numerical simulation of heat flux and current density
[J].
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES,
2004, 27 (03)
:472-479
[44]
VAWT STOCHASTIC LOADS USING A 3-D TURBULENCE SIMULATION
[J].
WINDPOWER 88 PROCEEDINGS,
1988,
:175-184
[45]
3-D device simulation using intelligent solution method
[J].
VLSI DESIGN,
1998, 6 (1-4)
:267-272
[46]
3-D simulation using for hydraulic calculation of the heat accumulator
[J].
XI INTERNATIONAL CONFERENCE ON COMPUTATIONAL HEAT, MASS AND MOMENTUM TRANSFER (ICCHMT 2018),
2018, 240
[48]
Flip chip on board solder joint reliability analysis using 2-D and 3-D FEA models
[J].
IEEE TRANSACTIONS ON ADVANCED PACKAGING,
2001, 24 (04)
:499-506
[49]
INVESTIGATION OF THERMAL AND DIMENSIONAL BEHAVIOR OF 3-D PRINTED MATERIALS USING THERMAL IMAGING AND 3-D SCANNING
[J].
THERMAL SCIENCE,
2023, 27 (01)
:21-31