An investigation of 3-D curled chip in machining - Part 2: Simulation and validation using Fe techniques

被引:6
作者
Ghosh, R [1 ]
Dillon, OW [1 ]
Jawahir, IS [1 ]
机构
[1] Univ Kentucky, Dept Mech Engn, Ctr Robot & Mfg Syst, Lexington, KY 40506 USA
关键词
D O I
10.1080/10940349808945662
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
This paper presents a finite element modeling approach for the 3-D curled chip. Four different chip types, with varying complexities are modeled using this approach. The complexities include chip twist, serrations on the inner radius of the chip, thickness variation along the length of the chip, etc. The chip is treated as a 3-D elastic beam and the neutral axis of the chip is modeled as a 3-D spiral with instantaneously varying center and curl radius. Bending and shear stresses generated in the chip show very distinct patterns. Comparisons made between the mechanics-based and finite element models show good correlation in the magnitude and location of the failure stresses. The 3-D chip breaking pattern was also observed using high-speed filming techniques, and comparisons made between the FE model and experimental results show good correlation.
引用
收藏
页码:117 / 135
页数:19
相关论文
共 50 条
[31]   A Galerkin Method for the Simulation of the Transient 2-D/2-D and 3-D/3-D Linear Boltzmann Equation [J].
Matthias K. Gobbert ;
Samuel G. Webster ;
Timothy S. Cale .
Journal of Scientific Computing, 2007, 30 :237-273
[32]   3-D radar imaging using range migration techniques [J].
Lopez-Sanchez, JM ;
Fortuny-Guasch, J .
IEEE TRANSACTIONS ON ANTENNAS AND PROPAGATION, 2000, 48 (05) :728-737
[33]   Modeling of 3D abrasive waterjet machining .2. Simulation of machining [J].
Yong, Z ;
Kovacevic, R .
13TH INTERNATIONAL CONFERENCE ON JETTING TECHNOLOGY, 1996, (21) :83-89
[34]   Numerical Simulation and Validation of Multiscale 3D Laser Spiral Machining of Microholes [J].
Dong, Yiwei ;
Ye, Qianwen ;
Li, Qi ;
Guo, Xiang ;
Zhang, Saitao ;
Hou, Naixian .
LASER AND PARTICLE BEAMS, 2022, 2022
[35]   3-D Numerical Simulation and Validation of Underfill Flow of Flip-Chips [J].
Moon, Sung-Won ;
Li, Zhihua ;
Gokhale, Shripad ;
Wang, Jinlin .
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2011, 1 (10) :1517-1522
[36]   3-D seakeeping analysis with water on deck and slamming. Part 2: Experiments and physical investigation [J].
Greco, M. ;
Bouscasse, B. ;
Lugni, C. .
JOURNAL OF FLUIDS AND STRUCTURES, 2012, 33 :148-179
[37]   3-D simulation of thin-wall injection molded part by CAE [J].
Cha, SY ;
Lai, FS .
ANTEC 2000: SOCIETY OF PLASTICS ENGINEERS TECHNICAL PAPERS, CONFERENCE PROCEEDINGS, VOLS I-III, 2000, :739-743
[38]   Validation of Physics-Based Image Systems Simulation With 3-D Scenes [J].
Lyu, Zheng ;
Goossens, Thomas ;
Wandell, Brian ;
Farrell, Joyce .
IEEE SENSORS JOURNAL, 2022, 22 (20) :19400-19410
[39]   3-D Model Reconstruction and Mold Flow Simulation for an Existing Shaped Part [J].
Chang, Dar-Yuan ;
Chang, Jia-Yuan .
INDUSTRIAL ENGINEERING AND APPLIED RESEARCH, 2014, 620 :65-68
[40]   Investigation of solids transport in a single-screw extruder using a 3-D discrete particle simulation [J].
Moysey, PA ;
Thompson, AR .
POLYMER ENGINEERING AND SCIENCE, 2004, 44 (12) :2203-2215