Junction Ni/Al2O3 elaborated by thermocompression:: Determination of the thermal residual stresses

In this study, the analysis of thermal residual stresses in a nickel-alumina bimaterial are studied using finite element analysis. The variation of the normal thermal residual stress and shear stress is evaluated near the interface of the bimaterials. The effect of the temperature gradient, the thickness of the material, and the size of the assembly on the distribution of thermal stresses are highlighted. The mechanical resistance to fracture of this type of assembly mainly depends on these residual stresses, which are initiated after the elaboration process of the bimaterials.