Characterization of Electrodeposited Copper Films with Time-of-Flight SIMS

被引：1
|
作者：
Demers, H. [1 ]
Emekli, U. [2 ]
Lifshin, E. [1 ]
West, A. C. [2 ]
机构：
[1] SUNY Albany, Coll Nanoscale Sci & Engn, Albany, NY 12203 USA
[2] Columbia Univ, Dept Chem Engn, New York, NY USA
来源：
MICROSCOPY AND MICROANALYSIS | 2009年 / 15卷
关键词：
D O I：
10.1017/S143192760909607X
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
[No abstract available]
引用
收藏
页码：492 / 493
页数：2
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