Creep-fatigue life of Sn-8Zn-3Bi solder under multiaxial loading

被引：16

作者：

Yamamoto, Takaei ^{[2
]}

Itoh, Takamoto ^{[1
]}

Sakane, Masao ^{[3
]}

Tsukada, Yutaka ^{[4
]}

机构：

[1] Univ Fukui, Div Mech Engn, Grad Sch Engn, Fukui 9108507, Japan

[2] Oita Univ, Dept Mech Engn, Oita 8701192, Japan

[3] Ritsumeikan Univ, Dept Mech Engn, Kusatsu, Shiga 5258577, Japan

[4] I PACKs Consulting, Konan, Shiga 5203243, Japan

来源：

INTERNATIONAL JOURNAL OF FATIGUE | 2012年 / 43卷

关键词：

Creep-fatigue; Low cycle fatigue; Electronic materials; Biaxial stress; Life prediction; LOW-CYCLE FATIGUE; SN-PB SOLDER; 63SN-37PB SOLDER; EUTECTIC SOLDER; TEMPERATURE; BEHAVIOR; ALLOY; MECHANISMS; FREQUENCY; 63SN/37PB;

D O I：

10.1016/j.ijfatigue.2012.04.007

中图分类号：

TH [机械、仪表工业];

学科分类号：

0802 ;

摘要：

This paper describes a creep-fatigue life of Sn-8Zn-3Bi solder under multiaxial loading. A push-pull and a reversed torsion tests were carried out using seven types of strain waveforms, which are a fast-fast, a fast-slow, a slow-fast and a slow-slow waveforms and three types trapezoidal strain waveforms with different strain holding times. The strain waveforms had a significant effect on creep-fatigue life and the shortest creep-fatigue life was found in the slow-fast strain waveform while the longest life in the slow-slow waveform in the push-pull and the reversed torsion tests. Creep-fatigue life in the reversed torsion test was approximately twice longer than that in the push-pull test at each strain waveform. Applicability of common used creep-fatigue damage models for life evaluation was discussed based on the obtained experimental results and only a grain boundary sliding model could evaluate the lives within a small scatter. (C) 2012Elsevier Ltd. All rights reserved.

引用

页码：235 / 241

页数：7

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