共 7 条
[1]
BERRICHE R, 1999, EFFECTS OXIDATION MO
[2]
The effect of the oxidation of Cu-base leadframe on the interface adhesion between Cu metal and epoxy molding compound
[J].
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING,
1997, 20 (02)
:167-175
[3]
CHONG CT, 1995, IEEE 45 ECT C, P463
[4]
KIM S, 1991, IEEE 41 CT C, P750
[5]
STUDIES OF THE THERMAL-DECOMPOSITION OF BETA-NIO(OH) AND NICKEL PEROXIDE BY X-RAY PHOTOELECTRON-SPECTROSCOPY
[J].
JOURNAL OF THE CHEMICAL SOCIETY-FARADAY TRANSACTIONS I,
1983, 79
:1769-1778
[6]
OHSUGA H, 1994, IEEE 44 ECT C, P141
[7]
TAKANO E, 1997, IEEE 47 ECT C, P78