Atomistic mechanisms of moisture-induced fracture at copper-silica interfaces

被引：9

作者：

Vijayashankar, Dandapani ^{[1
]}

Zhu, Hong ^{[2
]}

Garg, Saurabh ^{[1
]}

Teki, Ranganath ^{[1
]}

Ramprasad, R. ^{[2
]}

Lane, Michael W. ^{[3
]}

Ramanath, Ganpati ^{[1
]}

机构：

[1] Rensselaer Polytech Inst, Mat Sci & Engn Dept, Troy, NY 12180 USA

[2] Univ Connecticut, Chem Mat & Biomol Engn Dept, Storrs, CT 06269 USA

[3] Emory & Henry Coll, Dept Chem, Emory, VA 24327 USA

来源：

APPLIED PHYSICS LETTERS | 2011年 / 99卷 / 13期

基金：

美国国家科学基金会;

关键词：

adhesion; ceramics; copper; delamination; density functional theory; dielectric materials; electron spectra; fracture toughness; fracture toughness testing; silicon compounds; SUBCRITICAL CRACK-GROWTH; AUGMENTED-WAVE METHOD; MOLECULES; ADHESION; BEHAVIOR; SOLIDS; FILMS; GLASS;

D O I：

10.1063/1.3622304

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

Tailoring the chemo-mechanical properties of metal-dielectric interfaces is crucial for many applications including nanodevice wiring, packaging, composites, and catalysis. Here, we combine moisture-induced fracture tests, electron spectroscopy, and density functional theory calculations to reveal fracture toughness partitioning and atomistic delamination mechanisms at copper-silica interfaces. Copper plasticity is supported above a threshold work of adhesion and delamination occurs by moisture-induced Cu-O bond scission in Cu-O-Si bridges. These results provide insights into the effects of the nature of metal-oxygen bonding on moisture-induced delamination of metal-dielectric interfaces. (C) 2011 American Institute of Physics. [doi: 10.1063/1.3622304]

引用

页数：3

共 22 条

[1] THEORETICAL-STUDY OF THE THERMOCHEMISTRY OF MOLECULES IN THE SI-O-H SYSTEM [J].

ALLENDORF, MD ;

MELIUS, CF ;

HO, P ;

ZACHARIAH, MR .

JOURNAL OF PHYSICAL CHEMISTRY, 1995, 99 (41) :15285-15293

[2]

Bhatnagar A, 2000, J AM CERAM SOC, V83, P585, DOI 10.1111/j.1151-2916.2000.tb01237.x

[3] PROJECTOR AUGMENTED-WAVE METHOD [J].

BLOCHL, PE .

PHYSICAL REVIEW B, 1994, 50 (24) :17953-17979

[4] Gold: a relatively new catalyst [J].

Bond, GC .

CATALYSIS TODAY, 2002, 72 (1-2) :5-9

[5] On the physics of moisture-induced cracking in metal-glass (copper-silica) interfaces [J].

Card, J. C. ;

Cannon, R. M. ;

Saiz, E. ;

Tomsia, A. P. ;

Ritchie, R. O. .

JOURNAL OF APPLIED PHYSICS, 2007, 102 (05)

[6] KINETICS OF INDENTATION CRACKING IN GLASS [J].

COOK, RF ;

LINIGER, EG .

JOURNAL OF THE AMERICAN CERAMIC SOCIETY, 1993, 76 (05) :1096-1105

[7] Annealing-induced interfacial toughening using a molecular nanolayer [J].

Gandhi, Darshan D. ;

Lane, Michael ;

Zhou, Yu ;

Singh, Amit P. ;

Nayak, Saroj ;

Tisch, Ulrike ;

Eizenberg, Moshe ;

Ramanath, Ganapathiraman .

NATURE, 2007, 447 (7142) :299-U2

[8] Diffusion barrier properties of carboxyl- and amine-terminated molecular nanolayers [J].

Ganesan, PG ;

Singh, AP ;

Ramanath, G .

APPLIED PHYSICS LETTERS, 2004, 85 (04) :579-581

[9] Four-point bend adhesion measurements of copper and permalloy systems [J].

Hughey, MP ;

Morris, DJ ;

Cook, RF ;

Bozeman, SP ;

Kelly, BL ;

Chakravarty, SLN ;

Harkens, DP ;

Stearns, LC .

ENGINEERING FRACTURE MECHANICS, 2004, 71 (02) :245-261

[10] MIXED-MODE CRACKING IN LAYERED MATERIALS [J].

HUTCHINSON, JW ;

SUO, Z .

ADVANCES IN APPLIED MECHANICS, VOL 29, 1992, 29 :63-191

← 1 2 3 →