Relationship between leakage current and the type of passivation layer of hydrogenated amorphous silicon thin-film transistors

被引:8
作者
Lee, HN [1 ]
Cho, JH [1 ]
Kim, HJ [1 ]
机构
[1] BOE HYDIS, LCD R&D Ctr, Ichon 467701, Kyoungki Do, South Korea
来源
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS | 2003年 / 42卷 / 10期
关键词
leakage current; passivation; amorphous; silicon; TFT; SiNx; organic;
D O I
10.1143/JJAP.42.6678
中图分类号
O59 [应用物理学];
学科分类号
摘要
The variations in the device characteristics of hydrogenated amorphous silicon thin film transistors according to the passivation layers and manufacturing processes have been studied. If a thin SiNx layer is used as a passivation layer, leakage current is increased over one order of magnitude after the deposition of transparent conducting oxide on the passivation layer. This phenomenon is the result of an accumulation of carriers in the active channel due to the surface charging on the passivation layer. The increase in leakage current is prohibited by using an organic passivation layer. The increase in thickness, the decrease in the dielectric constant and/or changes in passivation surface state as the organic layer is used instead of a SiNx layer cause the,reduction in leakage current. The knowledge acquired from this work is useful in fabricating reliable switching arrays for flat-panel displays.
引用
收藏
页码:6678 / 6682
页数:5
相关论文
共 19 条
[1]  
CHUNG IJ, 2000, P 1 INT DISPL MAN C, P155
[2]   Switching performance of high rate deposition processing a-Si:H TFTs [J].
Fukuda, K ;
Imai, N ;
Kawamura, S ;
Matsumura, K ;
Ibaraki, N .
JOURNAL OF NON-CRYSTALLINE SOLIDS, 1996, 198 :1137-1140
[3]   Current-source a-Si:H thin-film transistor circuit for active-matrix organic light-emitting displays [J].
He, Y ;
Hattori, R ;
Kanicki, J .
IEEE ELECTRON DEVICE LETTERS, 2000, 21 (12) :590-592
[4]  
HWANG CS, 2001, P 21 INT DISPL RES C, P1165
[5]  
KANICKI J, 2001, P AS DISPL IDW 01, P315
[6]   Importance of first layer thickness on TFT characteristics using a-Si:H deposited by 2-step process [J].
Kashiro, T ;
Kawamura, S ;
Imai, N ;
Fukuda, K ;
Matsumura, K ;
Ibaraki, N .
JOURNAL OF NON-CRYSTALLINE SOLIDS, 1996, 198 :1130-1133
[7]  
KIM CW, 2000, P 1 INT DISPL MAN C, P181
[8]   THIN-FILM TRANSISTORS WITH MULTISTEP DEPOSITED AMORPHOUS-SILICON LAYERS [J].
KUO, Y .
APPLIED PHYSICS LETTERS, 1995, 67 (15) :2173-2175
[9]   PLASMA-ETCHING AND DEPOSITION FOR A-SI-H THIN-FILM TRANSISTORS [J].
KUO, Y .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1995, 142 (07) :2486-2507
[10]   Hydrogenated amorphous silicon thin film transistor fabricated on plasma treated silicon nitride [J].
Lim, Byung Cheon ;
Choi, Young Jin ;
Choi, Jong Hyun ;
Jang, Jin .
2000, IEEE, Piscataway, NJ, United States (47)