Mechanical Properties and Electrochemical Corrosion Behavior of Al/Sn-9Zn-xAg/Cu Joints

被引：37

作者：

Huang, M. L. ^{[1
]}

Huang, Y. Z. ^{[1
]}

Ma, H. T. ^{[1
]}

Zhao, J. ^{[1
]}

机构：

[1] Dalian Univ Technol, Elect Packaging Mat Lab, Sch Mat Sci & Engn, Dalian 116024, Peoples R China

来源：

JOURNAL OF ELECTRONIC MATERIALS | 2011年 / 40卷 / 03期

基金：

中国国家自然科学基金;

关键词：

Al-Cu joint; Sn-9Zn-xAg; mechanical properties; electrochemical corrosion; corrosion potential; LEAD-FREE SOLDER; FREE SN-ZN; GA SOLDER; CU; AG; MICROSTRUCTURE; WETTABILITY; ALLOYS; NI; BI;

D O I：

10.1007/s11664-010-1459-y

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The effect of Ag content on the wetting behavior of Sn-9Zn-xAg on aluminum and copper substrates during soldering, as well as the mechanical properties and electrochemical corrosion behavior of Al/Sn-9Zn-xAg/Cu solder joints, were investigated in the present work. Tiny Zn and coarsened dendritic AgZn(3) regions were distributed in the Sn matrix in the bulk Sn-9Zn-xAg solders, and the amount of Zn decreased while that of AgZn3 increased with increasing Ag content. The wettability of Sn-9Zn-1.5Ag solder on Cu substrate was better than those of the other Sn-9Zn-xAg solders but worse than that of Sn-9Zn solder. The wettability of Sn-9Zn-1.5Ag on the Al substrate was also better than those of the other Sn-9Zn-xAg solders, and even better than that of Sn-9Zn solder. The Al/Sn-9Zn/Cu joint had the highest shear strength, and the shear strength of the Al/Sn-9Zn-xAg/Cu (x = 0 wt.% to 3 wt.%) joints gradually decreased with increasing Ag content. The corrosion resistance of the Sn-9Zn-xAg solders in Al/Sn-9Zn-xAg/Cu joints in 5% NaCl solution was improved compared with that of Sn-9Zn. The corrosion potential of Sn-9Zn-xAg solders continuously increased with increasing Ag content from 0 wt.% to 2 wt.% but then decreased for Sn-9Zn-3Ag. The addition of Ag resulted in the formation of the AgZn3 phase and in a reduction of the amount of the eutectic Zn phase in the solder matrix; therefore, the corrosion resistance of the Al/Sn-9Zn-xAg/Cu joints was improved.

引用

页码：315 / 323

页数：9

共 13 条

[1] BRAUNOVIC M, 1994, 39 IEEE HOLM C EL CO, V17, P78
[2] Bukat K, 2008, ARCH METALL MATER, V53, P1065
[3] Enhancement of the wettability and solder joint reliability at the Sn-9Zn0.5Ag lead-free solder alloy-Cu interface by Ag precoating
Chang, TC
Hsu, YT
Hon, MH
Wang, MC
[J]. JOURNAL OF ALLOYS AND COMPOUNDS, 2003, 360 (1-2) : 217 - 224
[4] The microstructures and mechanical properties of the Sn-Zn-Ag-Al-Ga solder alloys - the effect of Ag
Chen, KI
Lin, KL
[J]. JOURNAL OF ELECTRONIC MATERIALS, 2002, 31 (08) : 861 - 867
[5] Interfacial reactions of lead-free Sn-Zn based solders on Cu and Cu plated electroless Ni-P/Au layer under aging at 150 °C
Huang, CW
Lin, KL
[J]. JOURNAL OF MATERIALS RESEARCH, 2004, 19 (12) : 3560 - 3568
[6] Effects of Ag and Cu addition on microstructural properties and oxidation resistance of Sn-Zn eutectic alloy
Lee, Jae-Ean
Kim, Keun-Soo
Inoue, Masahiro
Jiang, Junxiang
Suganuma, Katsuaki
[J]. JOURNAL OF ALLOYS AND COMPOUNDS, 2008, 454 (1-2) : 310 - 320
[7] The effect of Ga content on the wetting reaction and interfacial morphology formed between Sn-8.55Zn-0.5Ag-0.1Al-xGa solders and Cu
Liu, NS
Lin, KL
[J]. SCRIPTA MATERIALIA, 2006, 54 (02) : 219 - 224
[8] Microstructure and XRD analysis of FSW joints for copper T2/aluminium 5A06 dissimilar materials
Liu, Peng
Shi, Qingyu
Wang, Wei
Wang, Xin
Zhang, Zenglei
[J]. MATERIALS LETTERS, 2008, 62 (25) : 4106 - 4108
[9] Ma HT, 2007, J MATER SCI TECHNOL, V23, P81
[10] Electrochemical corrosion behaviour of lead-free Sn-8.5 Zn-X Ag-0.1 Al-0.5 Ga solder in 3.5% NaCl solution
Mohanty, US
Lin, KL
[J]. MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2005, 406 (1-2): : 34 - 42

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