Ultra high Q embedded inductors in highly miniaturized family of low loss organic substrates

被引：10

作者：

Athreya, Dhanya ^{[1
]}

Sundaram, Venky ^{[1
]}

Iyer, Mahadevan ^{[1
]}

Tummala, Rao ^{[1
]}

机构：

[1] Georgia Inst Technol, Sch Elect & Comp Engn, Packaging Res Ctr, Atlanta, GA 30332 USA

来源：

58TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, PROCEEDINGS | 2008年

关键词：

D O I：

10.1109/ECTC.2008.4550270

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

This paper presents the design, fabrication and measurement of high Q miniaturized inductors on a new family of ultra thin organic substrates. This paper for the first time discusses the design and fabrication of embedding ultra miniaturized RF inductors in ultra thin (100 - 150 microns thickness) organic substrates. The substrate described in this paper belongs to a new family of ultra low profile organic laminates with a loss tangent of about 0.0034 - 0.0045 and a dielectric constant of 3.4. Innovative inductor designs on this ultra thin substrate resulted in unloaded quality factors of about 100 - 150 in the frequency range of 1 - 15GHz and have line widths in the range of 2 - 4 mils and occupying an area of 0.062 - 0.64 mm(2). Design optimization, modeling and simulations performed are discussed in detail. Two test vehicles - test vehicle 1 (TV1) made up of two metal layers, having a thickness of 100 microns and test vehicle 2 (TV2), consisting of four metal layers and 150 microns in thickness have been used for the design of these inductors.

引用

页码：2073 / 2080

页数：8