Ultra high Q embedded inductors in highly miniaturized family of low loss organic substrates

被引：10

作者：

Athreya, Dhanya ^{[1
]}

Sundaram, Venky ^{[1
]}

Iyer, Mahadevan ^{[1
]}

Tummala, Rao ^{[1
]}

机构：

[1] Georgia Inst Technol, Sch Elect & Comp Engn, Packaging Res Ctr, Atlanta, GA 30332 USA

来源：

58TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, PROCEEDINGS | 2008年

关键词：

D O I：

10.1109/ECTC.2008.4550270

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

This paper presents the design, fabrication and measurement of high Q miniaturized inductors on a new family of ultra thin organic substrates. This paper for the first time discusses the design and fabrication of embedding ultra miniaturized RF inductors in ultra thin (100 - 150 microns thickness) organic substrates. The substrate described in this paper belongs to a new family of ultra low profile organic laminates with a loss tangent of about 0.0034 - 0.0045 and a dielectric constant of 3.4. Innovative inductor designs on this ultra thin substrate resulted in unloaded quality factors of about 100 - 150 in the frequency range of 1 - 15GHz and have line widths in the range of 2 - 4 mils and occupying an area of 0.062 - 0.64 mm(2). Design optimization, modeling and simulations performed are discussed in detail. Two test vehicles - test vehicle 1 (TV1) made up of two metal layers, having a thickness of 100 microns and test vehicle 2 (TV2), consisting of four metal layers and 150 microns in thickness have been used for the design of these inductors.

引用

页码：2073 / 2080

页数：8

共 13 条

[1]

BLASCHKE V, 2007, MICR TEST STRUCT 200, P248

[2] Multilayer thin-film MCM-D for the integration of high-performance RF and microwave circuits [J].

Carchon, G ;

Vaesen, K ;

Brebels, S ;

De Raedt, W ;

Beyne, E ;

Nauwelaers, B .

IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2001, 24 (03) :510-519

[3]

Fathy A, 2000, ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING, P261

[4] MCM-D implementation of passive RF components: Chip/package tradeoffs [J].

Frye, RC .

IEEE SYMPOSIUM ON IC/PACKAGE DESIGN INTEGRATION - PROCEEDINGS, 1998, :100-104

[5] Integration and electrical isolation in CMOS mixed-signal wireless chips [J].

Frye, RC .

PROCEEDINGS OF THE IEEE, 2001, 89 (04) :444-455

[6] 1996 IEEE International Frequency Control Symposium - A voltage controlled oscillator using low temperature co-fired ceramics [J].

OHearn, MD .

PROCEEDINGS OF THE 1996 IEEE INTERNATIONAL FREQUENCY CONTROL SYMPOSIUM (50TH ANNIVERSARY), 1996, :744-748

[7] Accurate modeling of high-Q spiral inductors in thin-film multilayer technology for wireless telecommunication applications [J].

Pieters, P ;

Vaesen, K ;

Brebels, S ;

Mahmoud, SF ;

De Raedt, W ;

Beyne, E ;

Mertens, RP .

IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 2001, 49 (04) :589-599

[8] Modeling and optimization of inductors with patterned ground shields for a high performance fully integrated switched tuning VCO [J].

Rotella, FM ;

Zachan, J .

PROCEEDINGS OF THE IEEE 2002 CUSTOM INTEGRATED CIRCUITS CONFERENCE, 2002, :221-224

[9] LTCC-MLC duplexer for DCS-1800 [J].

Sheen, JW .

IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 1999, 47 (09) :1883-1890

[10]

*SONN SOFTW, SONNET SUIT REL 11 5

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