Augmenting Computer-Aided Design Software With Multi-Functional Capabilities to Automate Multi-Process Additive Manufacturing

被引:16
作者
Bailey, Callum [1 ,2 ,3 ]
Aguilera, Efrain [1 ,2 ,4 ]
Espalin, David [5 ]
Motta, Jose [5 ]
Fernandez, Alfonso [5 ]
Perez, Mireya A. [5 ]
Dibiasio, Christopher [6 ]
Pryputniewicz, Dariusz [6 ]
Macdonald, Eric [1 ,7 ]
Wicker, Ryan B. [5 ]
机构
[1] Univ Texas El Paso, WM Keck Ctr Innovat 3D, El Paso, TX 79968 USA
[2] Univ Texas El Paso, Dept Elect & Comp Engn, El Paso, TX 79968 USA
[3] United Technol Res Ctr, E Hartford, CT 06118 USA
[4] Texas Instruments Inc, Dallas, TX 75243 USA
[5] Univ Texas El Paso, Dept Mech Engn, WM Keck Ctr Innovat 3D, El Paso, TX 79968 USA
[6] Draper Lab, Cambridge, MA 02139 USA
[7] Youngstown State Univ, Youngstown, OH 44555 USA
来源
IEEE ACCESS | 2018年 / 6卷
关键词
3D printing; additive manufacturing; automation; CADCAM; component placement; printed circuits; three-dimensional integrated circuits; wire embedding; 3D; STEREOLITHOGRAPHY;
D O I
10.1109/ACCESS.2017.2781249
中图分类号
TP [自动化技术、计算机技术];
学科分类号
0812 ;
摘要
The ability to access individual layers of a part as they are being printed has allowed additive manufacturing (AM) researchers to experiment with the in situ placement of components, thereby creating multi-process parts with additional functionality, such as customized printed electronics. As AM has evolved to become an established method for creating end-use parts, this interest in multi-process printing has increased. Although progress has been made in developing multi-process hardware, which can combine AM with other technologies, holistic design software, capable of readily integrating these processes, is developing at a slower rate. In this paper, an integrated software solution capable of supporting multi-process 3D printing from design through manufacture is described, featuring the integration of electronic components and circuits interconnected by copper wires. This solution features automated generation of the cavities that accommodate electronic components as well as toolpath generation for a multi-process 3D printer capable of automated wire embedding. As a case study of the developed technology, a hexagonal 3D printed body, which included a microcontroller, four LEDs, a USB connector, two resistors, and a Zener diode, all interconnected by embedded copper wires, was fabricated within a short cycle time: 5.75 h from design to fabricated part. Short cycle times allow multiple design iterations to be realized and printed within the same day.
引用
收藏
页码:1985 / 1994
页数:10
相关论文
共 21 条
  • [1] Aguilera Efrain., 2013, Proceedings of the Solid Freeform Fabrication Symposium, P950
  • [2] Ahlers D., 2015, THESIS
  • [3] [Anonymous], 2015, AURTODESK VOXE18 MAK
  • [4] Arnal Nicholas, 2015, 2015 IEEE MTT-S International Microwave Symposium (IMS2015), P1, DOI 10.1109/MWSYM.2015.7167154
  • [5] Claus R., 2002, NASATM2002211902
  • [6] 3D Printing multifunctionality: structures with electronics
    Espalin, David
    Muse, Danny W.
    MacDonald, Eric
    Wicker, Ryan B.
    [J]. INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY, 2014, 72 (5-8) : 963 - 978
  • [7] The status, challenges, and future of additive manufacturing in engineering
    Gao, Wei
    Zhang, Yunbo
    Ramanujan, Devarajan
    Ramani, Karthik
    Chen, Yong
    Williams, Christopher B.
    Wang, Charlie C. L.
    Shin, Yung C.
    Zhang, Song
    Zavattieri, Pablo D.
    [J]. COMPUTER-AIDED DESIGN, 2015, 69 : 65 - 89
  • [8] A Simple, Low-Cost Conductive Composite Material for 3D Printing of Electronic Sensors
    Leigh, Simon J.
    Bradley, Robert J.
    Purssell, Christopher P.
    Billson, Duncan R.
    Hutchins, David A.
    [J]. PLOS ONE, 2012, 7 (11):
  • [9] Integrating stereolithography and direct print technologies for 3D structural electronics fabrication
    Lopes, Amit Joe
    MacDonald, Eric
    Wicker, Ryan B.
    [J]. RAPID PROTOTYPING JOURNAL, 2012, 18 (02) : 129 - 143
  • [10] 3D Printing for the Rapid Prototyping of Structural Electronics
    Macdonald, Eric
    Salas, Rudy
    Espalin, David
    Perez, Mireya
    Aguilera, Efrain
    Muse, Dan
    Wicker, Ryan B.
    [J]. IEEE ACCESS, 2014, 2 : 234 - 242