Crystallization Behaviour of Electroless Ni-P UBM with Medium Phosphorous Induced by Single and Step Heat Treatment

被引:4
作者
Kang, Han-Byul [1 ,2 ]
Park, Jongwoo [2 ]
Bae, Jee-Hwan [1 ]
Yang, Cheol-Woong [1 ]
机构
[1] Sungkyunkwan Univ, Sch Adv Mat Sci & Eng, Suwon 440746, South Korea
[2] Samsung Elect, Technol Reliabil Syst LSI, Yongin 446711, South Korea
关键词
under bump metallization; electroless nickel phosphorous; in situ; transmission electron microscopy (TEM); THERMAL-STABILITY; PLATING LAYER; SOLDER JOINTS; CU SUBSTRATE; NICKEL; ALLOYS; COATINGS; DEPOSITS; MICROSCOPY;
D O I
10.2320/matertrans.M2010178
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
This study examined the crystallization behavior of electroless Ni P UBM with an medium phosphorous content (similar to 15 at%) induced by a single and step heat treatment using in situ transmission electron microscopy (TEM) Different heat treatment processes affected the crystallization behavior of electroless Ni P UBM After single heat treatment at 300 degrees C for 60 min the electroless Ni P UBM contained Ni and Ni3P In addition to Ni and Ni3P more complex Ni P compounds such as Ni12P5 and Ni5P2 formed in the electroless Ni P UBM resulting from a step heat treatment at 150 C for 60 min followed by 300 C for 60 min [doi 10 2320/matertrans M2010178]
引用
收藏
页码:1878 / 1882
页数:5
相关论文
共 22 条
[1]   Crystallization temperature of amorphous electroless nickel-phosphorus alloys [J].
Gao, JQ ;
Wu, YT ;
Lei, L ;
Bin, S ;
Hu, WB .
MATERIALS LETTERS, 2005, 59 (13) :1665-1669
[2]   STRUCTURE AND MECHANICAL PROPERTIES OF ELECTROLESS NICKEL [J].
GRAHAM, AH ;
LINDSAY, RW ;
READ, HJ .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1965, 112 (04) :401-&
[3]   Nanocrystalline Ni-3.6 at.% P and its transformation sequence studied by atom-probe field-ion microscopy [J].
Hentschel, T ;
Isheim, D ;
Kirchheim, R ;
Müller, F ;
Kreye, H .
ACTA MATERIALIA, 2000, 48 (04) :933-941
[4]   MICROSTRUCTURES AND CRYSTALLIZATION OF ELECTROLESS NI-P DEPOSITS [J].
HUR, KH ;
JEONG, JH ;
LEE, DN .
JOURNAL OF MATERIALS SCIENCE, 1990, 25 (05) :2573-2584
[5]   Initial interfacial reaction layers formed in Sn-3.5Ag solder/electroless Ni-P plated Cu substrate system [J].
Kang, Han-Byul ;
Lee, Jae-Wook ;
Bae, Jee-Hwan ;
Park, Min-Ho ;
Yoon, Jeong-Won ;
Jung, Seung-Boo ;
Ju, Jae-Seon ;
Yang, Cheol-Woong .
JOURNAL OF MATERIALS RESEARCH, 2008, 23 (08) :2195-2201
[6]   Characterization of interfacial reaction layers formed between Sn-3.5Ag solder and electroless Ni-immersion Au-plated Cu substrates [J].
Kang, Han-Byul ;
Bae, Jee-Hwan ;
Lee, Jae-Wook ;
Park, Min-Ho ;
Yoon, Jeong-Won ;
Jung, Seung-Boo ;
Yang, Cheol-Woong .
JOURNAL OF ELECTRONIC MATERIALS, 2008, 37 (01) :84-89
[7]   Control of interfacial reaction layers formed in Sn-3.5Ag-0.7Cu/electroless Ni-P solder joints [J].
Kang, Han-Byul ;
Bae, Jee-Hwan ;
Lee, Jae-Wook ;
Park, Min-Ho ;
Lee, Young-Chu ;
Yoon, Jeong-Won ;
Jung, Seung-Boo ;
Yang, Cheol-Woong .
SCRIPTA MATERIALIA, 2009, 60 (04) :257-260
[8]  
Kumar PS, 1996, J MATER PROCESS TECH, V56, P511
[9]  
MA EM, 1988, THIN SOLID FILMS, V166, P273, DOI 10.1016/0040-6090(88)90388-4
[10]  
MAEDA H, 1970, T NAT RES I METALS, V12, P211