A review of lead-free solders for electronics applications

被引：370

作者：

Cheng, Shunfeng ^{[1
]}

Huang, Chien-Ming ^{[2
]}

Pecht, Michael ^{[2
]}

机构：

[1] Intel Corp, 5200 NE Elam Young Pkwy, Hillsboro, OR 97124 USA

[2] Univ Maryland, CALCE Elect Prod & Syst Ctr, College Pk, MD 20742 USA

来源：

MICROELECTRONICS RELIABILITY | 2017年 / 75卷

关键词：

Lead-free solders; Electronics; Reliability; SAC; Alternative solders; SN-AG-CU; TIN WHISKER ANALYSIS; MECHANICAL-PROPERTIES; INTERMETALLIC GROWTH; SN-3.5AG SOLDER; SURFACE FINISH; SNAGCU-SOLDER; JOINTS; MICROSTRUCTURE; RELIABILITY;

D O I：

10.1016/j.microrel.2017.06.016

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Ever since RoHS was implemented in 2006, Sn3.0Ag0.5Cu (SAC305) has been the primary lead-free solder for attaching electronic devices to printed circuit boards (PCBs). However, due to the 3.0 wt% Silver (Ag) in SAC305, companies have been looking at less expensive solder alternatives, especially for use in inexpensive products that have short operating lives and are used in mild application conditions. This paper reviews new lead-free solder alternatives and the trends in the industry, including SnCu-based solders, SnAgCu solders with Ag content <1.0 wt%, SnAg solders, and no-Ag low-temperature solders (e.g., SnBi-based solders). The analysis is conducted for reflow, wave, and rework conditions and for packaged and flip-chip devices. (C) 2017 Elsevier Ltd. All rights reserved.

引用

页码：77 / 95

页数：19

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