Optoelectronic multichip module integration for chip level optical interconnects

We have integrated an 850-nm vertical-cavity surface-emitting laser (VCSEL), its driver, and a diffractive lenslet array onto a single substrate to produce an integrated optoelectronic multichip module for signal fan-out and distribution. The diffractive element performs optical fan-out of the output beam from the VCSEL into an array of focused spots at a plane 1,416 mum from the surface of the VCSEL. This corresponds to 160 mum from the surface of the diffractive lens. System design, fabrication, integration, and experimental characterization is presented.