Improvement in Mechanical Properties of 3D-Printed PEEK Structure by Nonsolvent Vapor Annealing

被引:24
作者
Chen, Wenhui [1 ,2 ]
Zhang, Xiaolong [1 ,2 ]
Tan, Di [1 ,2 ]
Xu, Peng [1 ,2 ]
Yang, Baisong [1 ,2 ]
Shi, Kui [1 ,2 ]
Zhu, Bo [1 ,2 ]
Liu, Quan [1 ,2 ]
Lei, Yifeng [1 ,2 ]
Liu, Sheng [1 ,2 ]
Xue, Longjian [1 ,2 ]
机构
[1] Wuhan Univ, Sch Power & Mech Engn, 8 South Donghu Rd, Wuhan 430072, Peoples R China
[2] Wuhan Univ, Inst Technol Sci, 8 South Donghu Rd, Wuhan 430072, Peoples R China
基金
国家重点研发计划; 中国国家自然科学基金;
关键词
3D printing; mechanical property; poly-ether-ether-ketone (PEEK); post-processing; solvent vapor annealing; MELTING BEHAVIOR; SOLVENT; POLYMER; PERFORMANCE; CRYSTALLIZATION; TOUGH; PARTS;
D O I
10.1002/marc.202100874
中图分类号
O63 [高分子化学(高聚物)];
学科分类号
070305 ; 080501 ; 081704 ;
摘要
The broad applications of 3D-printed poly-ether-ether-ketone (3D-PEEK) structures are largely hampered by their inadequate mechanical properties that can be improved by post treatments. At present, thermal annealing is generally used to improve the mechanical properties of 3D-PEEK. However, it cannot simultaneously improve strength and ductility. Here, a cost-effective postprocessing method is developed to improve the mechanical properties of 3D-PEEK, based on annealing in nonsolvent vapor at room temperature. The annealing in nonsolvent vapor at room temperature simultaneously improves the strength, ductility, and fracture energy of as-printed 3D-PEEK by 22.6%, 151.3%, and 109.1%, respectively. The improved mechanical properties are attributed to enhanced interfacial bonding, increased crystallinity, decreased pinhole defects, and stress relaxation in the 3D-PEEK. Moreover, the annealing in both polar solvents (such as acetone and chloroform) and nonpolar solvents (such as n-hexane) are demonstrated to be effective for improving the mechanical properties of 3D-PEEK. The nonsolvent vapor-annealed 3D-PEEK can thus have potential applications in the fields of medical implants, automotive, aerospace, and more.
引用
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页数:8
相关论文
共 51 条
[21]   Experimental study on parameters of 3D printing process for PEEK materials [J].
Liu, H. ;
Cheng, X. ;
Yang, X. H. ;
Zheng, G. M. ;
Guo, Q. J. .
2ND INTERNATIONAL WORKSHOP ON MATERIALS SCIENCE AND MECHANICAL ENGINEERING (IWMSME2018), 2019, 504
[22]   Bulk Interpenetration Network of Thermoelectric Polymer in Insulating Supporting Matrix [J].
Lu, Guanghao ;
Bu, Laju ;
Li, Sijun ;
Yang, Xiaoniu .
ADVANCED MATERIALS, 2014, 26 (15) :2359-2364
[23]   Impregnation and interlayer bonding behaviours of 3D-printed continuous carbon-fiber-reinforced poly-ether-ether-ketone composites [J].
Luo Meng ;
Tian Xiaoyong ;
Shang Junfan ;
Zhu Weijun ;
Li Dichen ;
Qin Yingjie .
COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING, 2019, 121 :130-138
[24]  
McPeak J., 1999, SOLVENT INDUCED CRYS
[25]   Tough, Bio-Inspired Hybrid Materials [J].
Munch, E. ;
Launey, M. E. ;
Alsem, D. H. ;
Saiz, E. ;
Tomsia, A. P. ;
Ritchie, R. O. .
SCIENCE, 2008, 322 (5907) :1516-1520
[26]   3D bioprinting of tissues and organs [J].
Murphy, Sean V. ;
Atala, Anthony .
NATURE BIOTECHNOLOGY, 2014, 32 (08) :773-785
[27]   Additive manufacturing (3D printing): A review of materials, methods, applications and challenges [J].
Ngo, Tuan D. ;
Kashani, Alireza ;
Imbalzano, Gabriele ;
Nguyen, Kate T. Q. ;
Hui, David .
COMPOSITES PART B-ENGINEERING, 2018, 143 :172-196
[28]  
Ouyang H., 2004, Macromolecules, V37, P7719
[29]   Solvent vapor induced dewetting in diblock copolymer thin films [J].
Peng, J ;
Xuan, Y ;
Wang, HF ;
Li, BY ;
Han, YC .
POLYMER, 2005, 46 (15) :5767-5772
[30]   An in-process laser localized pre-deposition heating approach to inter-layer bond strengthening in extrusion based polymer additive manufacturing [J].
Ravi, Abinesh Kurapatti ;
Deshpande, Anagh ;
Hsu, Keng H. .
JOURNAL OF MANUFACTURING PROCESSES, 2016, 24 :179-185