Enhancing the mechanical response of a lead-free solder using an energy-efficient microwave sintering route

被引：18

作者：

Babaghorbani, P. ^{[1
]}

Gupta, M. ^{[1
]}

机构：

[1] Natl Univ Singapore, Dept Mech Engn, Singapore 117576, Singapore

来源：

JOURNAL OF ELECTRONIC MATERIALS | 2008年 / 37卷 / 06期

关键词：

lead-free solder; microwave sintering; densification; tensile properties;

D O I：

10.1007/s11664-008-0399-2

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This study compares the effects of conventional and microwave sintering on the densification, microstructure, and tensile properties of a lead-free solder, Sn-3.5Ag. Conventional sintering was carried out in an inert atmosphere while microwave sintering was performed under ambient conditions. Microstructural characterization was carried out to investigate characteristics of grains, pores, and Ag3Sn intermetallic compounds. Tensile characterization studies revealed that 0.2% yield strength, ultimate tensile strength, and work of fracture were significantly increased by using microwave sintering.

引用

页码：860 / 866

页数：7

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