Thermal Resistance Analysis of Micro Channel Structure with 1D and Q2D Methods

被引：0

作者：

Chen, Shao-Wen ^{[1
,2
]}

Liu, Fang-Chin ^{[1
]}

Kuo, Feng-Jiun ^{[2
]}

Chai, Min-Lun ^{[2
]}

Poh, Cai-Shi ^{[2
]}

Lee, Jin-Der ^{[3
]}

Wang, Jong-Rong ^{[1
,4
]}

Lin, Hao-Tzu ^{[5
]}

Lin, Wei-Keng ^{[1
,2
]}

Shih, Chunkuan ^{[1
,4
]}

机构：

[1] Natl Tsing Hua Univ, Inst Nucl Engn & Sci, Hsinchu 30013, Taiwan

[2] Natl Tsing Hua Univ, Dept Engn & Syst Sci, Hsinchu 30013, Taiwan

[3] Natl Tsing Hua Univ, Nucl Sci & Technol Dev Ctr, Hsinchu 30013, Taiwan

[4] Nucl & New Energy Educ & Res Fdn, Hsinchu, Taiwan

[5] Inst Nucl Energy Res, Atom Energy Council, Hsinchu 32546, Taiwan

来源：

2016 5TH INTERNATIONAL SYMPOSIUM ON NEXT-GENERATION ELECTRONICS (ISNE) | 2016年

关键词：

Micro channels; Thermal resistance; Heat pipes; Boiling; Electronics cooling; CAPILLARY; GROOVES;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The one dimensional (1D) and quasi-two dimensional (Q2D) methods were applied to estimate and analyze the thermal resistance of the previous boiling experiments with silicon and copper micro channel wick structures. The variations of temperature and thermal resistance with different heat loads were shown, and the 1D and Q2D methods were used for calculation and comparison with experimental data. The results show that the Q2D method can predict the thermal tresistance with a higher accuracy because the spreading resistance is unignorable and should be considered. The present results can be a useful reference for future thermal and cooling designs.

引用

页数：2

共 6 条

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