Effects of Current Stressing on Formation and Evolution of Kirkendall Voids at Sn-3.5Ag/Cu Interface

被引：10
作者：
Yu, C. [1 ,2 ]
Yang, Y. [1 ]
Lu, H. [1 ,2 ]
Chen, J. M. [1 ,2 ]
机构：
[1] Shanghai Jiao Tong Univ, Sch Mat Sci & Engn, Shanghai 200240, Peoples R China
[2] Shanghai Key Lab Mat Laser Proc & Modificat, Shanghai 200240, Peoples R China
来源：
JOURNAL OF ELECTRONIC MATERIALS | 2010年 / 39卷 / 08期
基金：
中国国家自然科学基金;
关键词：
Kirkendall voids; current stressing; lead-free solder; interfacial reaction; SOLDER JOINTS; EUTECTIC SNPB; INTERMETALLIC COMPOUND; CU SUBSTRATE; ZN ADDITION; ELECTROMIGRATION; RELIABILITY; METALLIZATION; GROWTH; BUMPS;
D O I：
10.1007/s11664-010-1201-9
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Kirkendall voids (KVs) are known to be formed at the Cu/Cu(3)Sn interface, which can remarkably weaken solder joints. In this paper, the formation and evolution processes of KVs at Sn-3.5Ag/Cu joints were systematically investigated under isothermal aging and current stressing. It was found that the processes develop faster when joints are subjected to current stressing as opposed to thermal aging. This can be illuminated by the high KV densities caused by current stressing at both cathode and anode Cu/Cu(3)Sn interfaces. Moreover, KVs formed under current stressing showed some polarity characteristics, namely that higher KV density was observed on the anode side compared with the cathode side. The interfacial reaction generated at the Cu(3)Sn/Cu(6)Sn(5) interface, which was partly affected by current stressing, contributed to this polarity effect. As the holding time was prolonged, microvoids coalesced into larger porosities and microcracks. These defects will greatly threaten the reliability of the interface.
引用
收藏
页码：1309 / 1314
页数：6
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