Effects of Halo Doping and Si Capping Layer Thickness on Total-Dose Effects in Ge p-MOSFETs

被引:16
作者
Arora, Rajan [1 ,2 ]
Simoen, Eddy [3 ]
Zhang, En Xia [4 ]
Fleetwood, Daniel M. [4 ]
Schrimpf, Ronald D. [4 ]
Galloway, Kenneth F. [4 ]
Choi, Bo K. [4 ]
Mitard, Jerome [3 ,5 ]
Meuris, Marc [3 ]
Claeys, Cor [3 ,5 ]
Madan, Anuj [2 ]
Cressler, John D. [2 ]
机构
[1] Vanderbilt Univ, Dept Elect Engn & Comp Sci, Nashville, TN 37235 USA
[2] Georgia Inst Technol, Sch Elect & Comp Engn, Atlanta, GA 30332 USA
[3] Interuniv Microelect Ctr, B-3001 Leuven, Belgium
[4] Vanderbilt Univ, Dept Elect Engn & Comp Sci EECS, Nashville, TN 37235 USA
[5] Univ Leuven, ESAT INSYS, B-3000 Leuven, Belgium
关键词
Diode; Germanium; MOSFET; p(+) -n; x-ray; RADIATION-INDUCED CHARGE; MOS DEVICES; 1/F NOISE; LEAKAGE CURRENT; PMOSFETS;
D O I
10.1109/TNS.2010.2043745
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The total-dose response of Ge p-MOSFETs and p(+) -n junction diodes is reported for devices fabricated with several process variations. Radiation-induced reduction of the on-off current ratio increases with halo-doping density. Increasing the number of Si monolayers at the substrate/dielectric interface reduces total-dose sensitivity for p-MOSFETs. Reduced mobility degradation is observed after irradiation for devices with a higher number of Si monolayers. The radiation-induced increase in junction leakage is related to the increasing perimeter component of the leakage current. MOSFETs with a higher number of Si monolayers at the dielectric/substrate interface also have reduced perimeter leakage current. Diode leakage current increases with increasing halo-doping density.
引用
收藏
页码:1933 / 1939
页数:7
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