Thermal Management for Flip-chip High Power Amplifiers utilizing Carbon Nanotube Bumps

被引：0

作者：

Soga, Ikuo ^{[1
]}

Kondo, Daiyu ^{[1
]}

Yamaguchi, Yoshitaka ^{[1
]}

Iwai, Taisuke ^{[1
,2
]}

Kikkawa, Toshihide ^{[2
]}

Joshin, Kazukiyo ^{[2
]}

机构：

[1] Fujitsu Labs Ltd, Nanoelect Res Ctr, 10-1 Morinosato Wakamiya, Kanagawa 2430197, Japan

[2] Fujitsu Labs Ltd, Cpds Semicond Device Lab, Kanagawa 2430197, Japan

来源：

2009 IEEE INTERNATIONAL SYMPOSIUM ON RADIO-FREQUENCY INTEGRATION TECHNOLOGY (RFIT 2009) | 2009年

关键词：

Carbon nanotubes; high power amplifiers; flip-chip; GaN; HEMT;

D O I：

暂无

中图分类号：

TP301 [理论、方法];

学科分类号：

081202 ;

摘要：

Carbon nanotubes (CNTs) have been successfully used as source bumps for flip-chip high power amplifiers (HPAs). We have fabricated fine pitch CNT bumps with metal coating, which have been connected to electrodes close to the active areas of AlGaN/GaN HEMTs. A flip-chip AlGaN/GaN HEMT HPA with a gate width of 28.8 mm utilizing CNT bumps and an operating voltage of 50 V exhibits an output power of 49.3 dBm at a frequency of 2.4 GHz.

引用

页码：100 / +

页数：2

共 8 条

[1] Influence of growth mode of carbon nanotubes on physical properties for multiwalled carbon nanotube films grown by catalystic chemical vapor deposition [J].

Horibe, M ;

Nihei, M ;

Kondo, D ;

Kawabata, A ;

Awano, Y .

JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS, 2004, 43 (10) :7337-7341

[2]

Kikkawa T., 2004, 2004 IEEE MTT-S International Microwave Symposium Digest (IEEE Cat. No.04CH37535), P1347, DOI 10.1109/MWSYM.2004.1338818

[3] Thermal transport measurements of individual multiwalled nanotubes [J].

Kim, P ;

Shi, L ;

Majumdar, A ;

McEuen, PL .

PHYSICAL REVIEW LETTERS, 2001, 87 (21) :215502-1

[4] Selective growth of vertically aligned double- and single-walled carbon nanotubes on a substrate at 590°C [J].

Kondo, D. ;

Sato, S. ;

Kawabata, A. ;

Awano, Y. .

NANOTECHNOLOGY, 2008, 19 (43)

[5] Carbon nanotubes for interconnect applications [J].

Kreupl, F ;

Graham, AP ;

Liebau, M ;

Duesberg, GS ;

Seidel, R ;

Unger, E .

IEEE INTERNATIONAL ELECTRON DEVICES MEETING 2004, TECHNICAL DIGEST, 2004, :683-686

[6] Simultaneous formation of multiwall carbon nanotubes and their end-bonded ohmic contacts to Ti electrodes for future ULSI interconnects [J].

Nihei, M ;

Horibe, M ;

Kawabata, A ;

Awano, Y .

JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS, 2004, 43 (4B) :1856-1859

[7]

NIHEI M, IEEE 2005 IITC, P234

[8] Evaluation of thermal conductivity of a multi-walled carbon nanotube using the ΔVgs method [J].

Shioya, Hiroki ;

Iwai, Taisuke ;

Kondo, Daiyu ;

Nihei, Mizuhisa ;

Awano, Yuji .

JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS, 2007, 46 (5A) :3139-3143

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