Optimization of Transfer Times in Pinned Photodiodes

被引:1
|
作者
Girgenrath, Lutz [1 ,3 ]
Hofmann, Martin [1 ]
Kuehnhold, Ralf [1 ]
Vogt, Holger [2 ,3 ]
机构
[1] ELMOS Semicond AG, Heinrich Hertz Str 1, D-44227 Dortmund, Germany
[2] Fraunhofer Inst Microelect Circuits & Syst, Finkenstr 61, D-47057 Duisburg, Germany
[3] Univ Duisburg Essen, Duisburg, Germany
来源
PROCEEDINGS OF THE 5TH INTERNATIONAL CONFERENCE ON PHOTONICS, OPTICS AND LASER TECHNOLOGY (PHOTOPTICS) | 2017年
关键词
CMOS Imaging; Lateral Drift-field Photodetectors (LDPD); High-speed Imaging; Large Pixels; SILICON;
D O I
10.5220/0006239603120316
中图分类号
O43 [光学];
学科分类号
070207 ; 0803 ;
摘要
An implantation scheme which enhances the readout speed of a silicon pinned photodiode (PPD) with large pixel length is presented. The basic PPD structure was developed for Time-of-Flight (TOF) distance measurement applications by the Fraunhofer IMS in Duisburg, Germany, and was fabricated in a standard 0.35 mu m CMOS process. The optimized design of this PPD introduces the possibility to improve the electron readout speed by changing the n-well configuration with a second well implantation. The local increase in doping concentration creates a designated electron path which utilizes the reset voltage of the readout node. This behaviour is shown by simulation and measurement results are presented.
引用
收藏
页码:312 / 316
页数:5
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