Rapid, all dry microfabrication of three-dimensional Co3O4/Pt nanonetworks for high-performance microsupercapacitors

被引:26
作者
Ma, Xinyu [1 ]
Feng, Shuxuan [1 ]
He, Liang [1 ,2 ]
Yan, Mengyu [1 ]
Tian, Xiaocong [1 ]
Li, Yanxi [3 ]
Tang, Chunjuan [1 ,4 ]
Hong, Xufeng [1 ]
Mai, Liqiang [1 ,5 ]
机构
[1] Wuhan Univ Technol, Int Sch Mat Sci & Engn, State Key Lab Adv Technol Mat Synth & Proc, Wuhan 430070, Hubei, Peoples R China
[2] Rice Univ, Dept Mat Sci & NanoEngn, 6100 Main St, Houston, TX 77005 USA
[3] Virginia Tech, Dept Mat Sci & Engn, Blacksburg, VA 24061 USA
[4] Luoyang Inst Sci & Technol, Dept Math & Phys, Luoyang 471023, Peoples R China
[5] Univ Calif Berkeley, Dept Chem, Berkeley, CA 94702 USA
基金
中国国家自然科学基金; 中国博士后科学基金;
关键词
ELECTROCHEMICAL ENERGY-STORAGE; MICRO-SUPERCAPACITORS; ON-CHIP; CARBON-FILMS; FABRICATION; ELECTRODES; OXIDE; COMPOSITES; BEHAVIOR; DENSITY;
D O I
10.1039/c7nr01789h
中图分类号
O6 [化学];
学科分类号
0703 ;
摘要
On-chip electrochemical energy storage devices have attracted growing attention due to the decreasing size of electronic devices. Various approaches have been applied for constructing the microsupercapacitors. However, the microfabrication of high-performance microsupercapacitors by conventional and fully compatible semiconductor microfabrication technologies is still a critical challenge. Herein, unique three-dimensional (3D) Co3O4 nanonetwork microelectrodes formed by the interconnection of Co3O4 nanosheets are constructed by controllable physical vapor deposition combined with rapid thermal annealing. This construction process is an all dry and rapid (<= 5 minutes) procedure. Afterward, by sputtering highly electrically conductive Pt nanoparticles on the microelectrodes, the 3D Co3O4/Pt nanonetworks based microsupercapacitor is fabricated, showing a high volume capacitance (35.7 F cm(-3)) at a scan rate of 20 mV s(-1) due to the unique interconnected structures, high electrical conductivity and high surface area of the microelectrodes. This microfabrication process is also used to construct high-performance flexible microsupercapacitors, and it can be applied in the construction of wearable devices. The proposed strategy is completely compatible with the current semiconductor microfabrication and shows great potential in the applications of the large-scale integration of micro/nano and wearable devices.
引用
收藏
页码:11765 / 11772
页数:8
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