CHIP interacts with heat shock factor 1 during heat stress

被引：24
作者：
Kim, SA
Yoon, JH
Kim, DK
Kim, SG
Ahn, SG
机构：
[1] Chosun Univ, Coll Dent, Oral Biol Res Inst, Kwangju 501759, South Korea
[2] Chosun Univ, Coll Dent, Dept Pathol, BK21 Project, Kwangju 501759, South Korea
来源：
FEBS LETTERS | 2005年 / 579卷 / 29期
关键词：
heat shock factor 1; carboxyl terminus of the heat shock cognate protein 70-interacting protein; heat shock cognate protein 70; heat shock protein 70; heat shock protein 90; heat stress;
D O I：
10.1016/j.febslet.2005.10.043
中图分类号：
Q5 [生物化学]; Q7 [分子生物学];
学科分类号：
071010 ; 081704 ;
摘要：
Heat shock factor 1 (HSF1) is a major transactivator of heat shock genes in response to stress and mediates cell protection against various harmful conditions. In this study, we identified the interaction of CHIP (carboxyl terminus of the heat shock cognate protein 70-interacting protein) with the N-terminus of HSF1. Using GST full-down assay, we found that CHIP directly interacts with C-terminal deleted HST1 (a.a. 1-290) but not with full-length HSF1 under non-stressed conditions. Interestingly, interaction of CHIP with full-length HSF1 was induced by heat shock treatment. The structural change of HSF1 was observed under heat stressed conditions by CD spectra. These observations demonstrate the direct interaction between HSF1 and CHIP and this interaction requires conformational change of HSF1 by heat stress. (c) 2005 Federation of European Biochemical Societies. Published by Elsevier B.V. All rights reserved.
引用
收藏
页码：6559 / 6563
页数：5
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