Deep submicron (DSM) bulk technology;
metal-oxide semiconductor (MOS) transistors;
radiation-induced narrow channel effect (RINCE);
total ionizing dose;
INTERFACE STATE GENERATION;
TRAP BUILDUP;
CHARGE;
DEPENDENCE;
BIAS;
D O I:
10.1109/TNS.2011.2170854
中图分类号:
TM [电工技术];
TN [电子技术、通信技术];
学科分类号:
0808 ;
0809 ;
摘要:
Total ionizing dose effects are investigated in input/output transistors that are fabricated by using a commercial 0.18 mu m bulk process. An enhanced radiation-induced narrow channel effect is demonstrated in N-type metal-oxide semiconductor (NMOS) and P-type metal-oxide semiconductor (PMOS) transistors, leading to a significant threshold voltage shift which may compromise circuit operations. Calculations using a code dedicated to radiation-induced charge trapping in oxides show that the radiation-induced positive charge trapping in trench oxides leads to the modifications of the electrical characteristics experimentally evidenced. Radiation hardening issues are finally discussed as a function of the device geometry and design.