Multi-copolymerization retouch butadiene styrene block polymer resin for dual temperature change curing of wood-based interface

Carboxylated styrene-butadiene latex (XSBL), attributed to its insufficient adhesion and poor water resistance, cannot be widely popularized in the adhesive industry. Herein, a novel XSBL-based resin with high-strength yet water-resistant was reported, in which the butadiene macromolecular chains were grafted with acrylonitrile (AN) and acrylic acid-2 hydroxyethyl ester (HEA) molecules, the crosslinking sites were esterified and expanded to construct a branched network structure, and the matrix was filled with nano-SiO2 particles treated by blending silane coupling agents. We show that the new resin, having a dual curing mechanism at low and high temperatures, can be glued under different conditions. At room temperature, the sample group with a doping level of 1.33 wt% could achieve an overload shear strength of 3.17 MPa after curing, which is 233.7% higher than the XSBL; in the high temperature curing regime, the glue strength reached 1.21 MPa, much higher than the standard for the use of GB Class I plywood (>= 0.7 MPa). The physicochemical properties meet the requirements for potential industrialization, for which the property-structure relation has been extensively explored. Further DSC and TG tests provide evidence for their wide application in the hot pressing process of man-made plywood.