Enhanced thermal performance of vortex generating liquid heat sink for the application of cooling high voltage direct current devices

被引:6
|
作者
Ali, Ehtesham [1 ,2 ]
Park, Jaehyun [1 ]
Choi, Jaemun [1 ]
Han, Changwoo [3 ]
Park, Heesung [1 ,2 ]
机构
[1] Changwon Natl Univ, Dept Mech Engn, Chang Won, South Korea
[2] Changwon Natl Univ, Dept Smart Mfg Engn, Chang Won, South Korea
[3] HYOSUNG Corp, Power & Ind Syst R&D Ctr, Seoul, South Korea
基金
新加坡国家研究基金会;
关键词
MULTIPLE-JET IMPINGEMENT; MASS-FLOW DISTRIBUTION; TURBULENT PIPE; MANAGEMENT; CHANNEL; PHASE; CONVERTERS;
D O I
10.1007/s00231-021-03168-w
中图分类号
O414.1 [热力学];
学科分类号
摘要
An experimental investigation of serpentine design flow channel heat sinks has been carried out to assess their suitability for the thermal management of high voltage direct current (HVDC) devices. This study contributes to the effective cooling technique that utilizes the mixture of water (70%) and propylene glycol (30%) as a working fluid. Fluid flow and heat transfer characteristics are significantly affected by the geometrical parameters of the flow channels in heat sink which are experimentally investigated in this study. The effects of coolant flow rate and four different flow channel shapes on the heat sink performance are investigated in detail. The assessment of heat sink performance for HVDC device is based on several exclusive attributes such as temperature profile, Nusselt number, thermal resistance, pressure drop, pumping power, Colburn j-factor, and friction factor. We conclude that the flow channel with vortex generator installed heat sink shows the best performance in contrast to other types of flow channel heat sinks studied. The proposed experimental approach provides comprehensive insights into flow channel design configurations for heat sinks.
引用
收藏
页码:1157 / 1169
页数:13
相关论文
共 37 条
  • [1] Enhanced thermal performance of vortex generating liquid heat sink for the application of cooling high voltage direct current devices
    Ehtesham Ali
    Jaehyun Park
    Jaemun Choi
    Changwoo Han
    Heesung Park
    Heat and Mass Transfer, 2022, 58 : 1157 - 1169
  • [2] Performance improvement of high voltage direct current devices by using a novel vortex generating heat sink design
    Ali, Ehtesham
    Park, Chanwoo
    Kim, Deokhyeong
    Park, Heesung
    INTERNATIONAL JOURNAL OF THERMAL SCIENCES, 2025, 210
  • [3] A novel spiral grooved cooling path heat sink for the cooling of high voltage direct current devices
    Ali, Ehtesham
    Tamang, Sajan
    Park, Jaehyun
    Choi, Jaemun
    Choi, Jaehun
    Park, Chanwoo
    Park, Heesung
    INTERNATIONAL JOURNAL OF THERMAL SCIENCES, 2024, 195
  • [4] Investigation of enhanced PCM heat sink design under extreme thermal conditions for high-heat-generating electronic devices
    Lee, Sangwook
    Choi, Hongseok
    Park, Piljun
    Kang, Sungwook
    Choi, Kyutae
    Lee, Hoseong
    INTERNATIONAL COMMUNICATIONS IN HEAT AND MASS TRANSFER, 2024, 159
  • [5] Thermal Performance of Heat Sink for Cooling High LED Power Applications
    Haraka, Fadwa
    El Ouatouati, Ahmad
    Taha Janan, Mourad
    PROCEEDINGS OF 2016 INTERNATIONAL RENEWABLE & SUSTAINABLE ENERGY CONFERENCE (IRSEC' 16), 2016, : 278 - 280
  • [6] Application of a novel biological nanofluid in a liquid block heat sink for cooling of an electronic processor: Thermal performance and irreversibility considerations
    Bahiraei, Mehdi
    Heshmatian, Saeed
    ENERGY CONVERSION AND MANAGEMENT, 2017, 149 : 155 - 167
  • [7] Study of the performance of an integrated liquid cooling heat sink for high-power IGBTs
    Pan, Minqiang
    Hu, minglong
    Wang, hongqing
    APPLIED THERMAL ENGINEERING, 2021, 190
  • [8] Computational thermal fluid dynamic analysis of Hypervapotron heat sink for high heat flux devices application
    Domalapally, Phani
    Subba, Fabio
    FUSION ENGINEERING AND DESIGN, 2015, 98-99 : 1267 - 1270
  • [9] Investigating the performance of conventional and hydrophobic surface heat sink in managing thermal challenges of high heat generating components
    Babar, Hamza
    Wu, Hongwei
    Zhang, Wenbin
    INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 2023, 216
  • [10] Challenges in electronic cooling - Opportunities for enhanced - thermal management techniques - Microprocessor liquid cooled minichannel heat sink
    Schmidt, R
    FIRST INTERNATIONAL CONFERENCE ON MICROCHANNELS AND MINICHANNELS, 2003, : 951 - 959