Effect of Strain Rate on Joint Strength and Failure Mode of Lead-Free Solder Joints

被引：6

作者：

Lin, Jian ^{[1
]}

Lei, Yongping ^{[1
]}

Fu, Hanguang ^{[1
]}

Guo, Fu ^{[1
]}

机构：

[1] Beijing Univ Technol, Coll Mat Sci & Engn, Beijing 100124, Peoples R China

来源：

JOURNAL OF ELECTRONIC MATERIALS | 2018年 / 47卷 / 03期

基金：

中国国家自然科学基金; 北京市自然科学基金;

关键词：

Surface mount technology; lead-free solder; silver content; strain rate; failure mode; MECHANICAL-PROPERTIES; IMPACT; MICROSTRUCTURE; FRACTURE; FATIGUE;

D O I：

10.1007/s11664-017-6014-7

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

In surface mount technology, the Sn-3.0Ag-0.5Cu solder joint has a shorter impact lifetime than a traditional lead-tin solder joint. In order to improve the impact property of SnAgCu lead-free solder joints and identify the effect of silver content on tensile strength and impact property, impact experiments were conducted at various strain rates on three selected SnAgCu based solder joints. It was found that joint failure mainly occurred in the solder material with large plastic deformation under low strain rate, while joint failure occurred at the brittle intermetallic compound layer without any plastic deformation at a high strain rate. Joint strength increased with the silver content in SnAgCu alloys in static tensile tests, while the impact property of the solder joint decreased with increasing silver content. When the strain rate was low, plastic deformation occurred with failure and the tensile strength of the Sn-3.0Ag-0.5Cu solder joint was higher than that of Sn-0.3Ag-0.7Cu; when the strain rate was high, joint failure mainly occurred at the brittle interface layer and the Sn-0.3Ag-0.7Cu solder joint had a better impact resistance with a thinner intermetallic compound layer.

引用

页码：2073 / 2081

页数：9

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