NEW FABRICATION METHOD FOR HIGH-Q MEMS INDUCTORS

This study presents a novel fabrication method to enhance the quality of flexible MEMS inductors for wireless energy and data transmission applications. The fabrication process used parylene C as a polymeric substrate material with a thickness of 50 pm and patterned by a picosecond laser. We modeled the test device in a simulation and then verified its feasibility through experimentation. We computed the projected Q-factor enhancement to be approximately 8.9x the 2 mu m metal thickness of traditional evaporation methods at a 1 MHz operation frequency. The thickness of the metal, integrated with picosecond laser-cutting technology, resulted in an enhanced Q-factor compared to traditional multilayer or fold-and-bond methods. The production process was simple and did not require a bonding process. The research indicated that such Q-enhanced MEMS inductors could be integrated with biomedical implants for wireless energy and data transmission applications.