Non-Destructive Testing for Defects in Electronic Package Based on Infrared Thermography

被引：0
|
作者：
Liu Chengyan [1 ]
Qin Fei [1 ]
Ban Zhaowei [1 ]
机构：
[1] Beijing Univ Technol, Coll Mech Engn & Appl Elect Technol, Beijing, Peoples R China
来源：
2013 14TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) | 2013年
关键词：
electronic package; defect detection; infrared thermography; non-destructive testing; LOCK-IN THERMOGRAPHY; COMPOSITE STRUCTURES; FAILURE ANALYSIS; CIRCUITS; DEVICES;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Defects such as interfacial delaminations degrade the yield rate and reliability of the device. It's important to find and evaluate these defects on time. Infrared Thermography is proved to be a valuable tool for non-destructive testing of materials. In this paper the relationship between the thermal characteristics of the sample surface and the defect feature parameters is investigated using Infrared Thermography; while an approach to quantitatively evaluate the defect is proposed.
引用
收藏
页码：865 / 869
页数：5
相关论文
共 50 条
  • [1] Lock-in infrared thermography for the non-destructive testing of fatigue specimen with defects
    Zhao Y.
    Guo X.
    Ren M.
    Guangxue Xuebao/Acta Optica Sinica, 2010, 30 (10): : 2776 - 2781
  • [2] Lock-in Infrared Thermography for the Non-destructive Testing of Fatigue Specimen with Defects
    Zhao, Yanguang
    Guo, Xinglin
    Ren, Mingfa
    FRONTIERS OF MANUFACTURING AND DESIGN SCIENCE, PTS 1-4, 2011, 44-47 : 576 - 580
  • [3] Infrared Thermography for Temperature Measurement and Non-Destructive Testing
    Usamentiaga, Ruben
    Venegas, Pablo
    Guerediaga, Jon
    Vega, Laura
    Molleda, Julio
    Bulnes, Francisco G.
    SENSORS, 2014, 14 (07) : 12305 - 12348
  • [4] Ultrasonic infrared thermography in non-destructive testing: A review
    M. Z. Umar
    V. Vavilov
    H. Abdullah
    A. K. Ariffin
    Russian Journal of Nondestructive Testing, 2016, 52 : 212 - 219
  • [5] Active Infrared Thermography as a Method for Non-destructive Testing
    Hain, Miroslav
    Bartl, Jan
    17TH SLOVAK-CZECH-POLISH OPTICAL CONFERENCE ON WAVE AND QUANTUM ASPECTS OF CONTEMPORARY OPTICS, 2010, 7746
  • [6] Ultrasonic Infrared Thermography in Non-Destructive Testing: A Review
    Umar, M. Z.
    Vavilov, V.
    Abdullah, H.
    Ariffin, A. K.
    RUSSIAN JOURNAL OF NONDESTRUCTIVE TESTING, 2016, 52 (04) : 212 - 219
  • [7] Non-destructive characterisation of defects in devices using infrared thermography
    Kaminski, A
    Jouglar, J
    Volle, C
    Natalizio, S
    Vuillermoz, PL
    Laugier, A
    MICROELECTRONICS JOURNAL, 1999, 30 (11) : 1137 - 1140
  • [8] Non-destructive testing of works of art by stimulated infrared thermography
    Candore, J. C.
    Bodnar, J. L.
    Detalle, V.
    Grossel, P.
    EUROPEAN PHYSICAL JOURNAL-APPLIED PHYSICS, 2012, 57 (02):
  • [9] Development and Application of Infrared Thermography Non-Destructive Testing Techniques
    Qu, Zhi
    Jiang, Peng
    Zhang, Weixu
    SENSORS, 2020, 20 (14) : 1 - 27
  • [10] Infrared Thermography and Its Applications in Aircraft Non-destructive Testing
    Chen, Dapeng
    Zhang, Xiaolong
    Zhang, Guang
    Zhang, Yazhou
    Li, Xiaoli
    2016 INTERNATIONAL CONFERENCE ON IDENTIFICATION, INFORMATION AND KNOWLEDGE IN THE INTERNET OF THINGS (IIKI), 2016, : 374 - 379
12345