Printed circuit board as a MEMS platform for focused ion beam technology

被引：2

作者：

Cheneler, D. ^{[1
]}

Teng, J. ^{[1
]}

Adams, M. ^{[2
]}

Anthony, C. J. ^{[1
]}

Carter, E. L. ^{[1
]}

Ward, M. ^{[1
]}

机构：

[1] Univ Birmingham, Dept Mech & Mfg Engn, Birmingham B15 2TT, W Midlands, England

[2] Univ Birmingham, Dept Chem Engn, Birmingham B15 2TT, W Midlands, England

来源：

MICROELECTRONIC ENGINEERING | 2011年 / 88卷 / 01期

基金：

英国工程与自然科学研究理事会;

关键词：

Focused ion beam; Printed circuit board; Thermal sensor;

D O I：

10.1016/j.mee.2010.09.017

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

By combining low-cost printed circuit board technology and focused ion beam techniques, a simple method has been developed to produce thermal microsensors in a robust package with straightforward electrical connectivity. Two devices have been developed to demonstrate the principle. The first was fabricated using a single step process comprised of FIB deposited platinum. The second device utilised a multistep process using FIB milled thermally evaporated Au on a PCB platform with through-plated vias. The performance of these devices was tested by measuring their thermo-electrical characteristics. (C) 2010 Elsevier B.V. All rights reserved.

引用

页码：121 / 126

页数：6

共 6 条

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