Compressive behavior of an electrodeposited nanostructured copper at quasistatic and high strain rates

被引：62
作者：
Jia, D
Ramesh, KT
Ma, E
Lu, L
Lu, K
机构：
[1] Johns Hopkins Univ, Dept Mech Engn, Baltimore, MD 21218 USA
[2] Johns Hopkins Univ, Dept Mat Sci & Engn, Baltimore, MD 21218 USA
[3] Acad Sinica, Inst Met Res, State Key Lab RSA, Shenyang 110015, Peoples R China
来源：
SCRIPTA MATERIALIA | 2001年 / 45卷 / 05期
关键词：
nc-copper; TEM; grain boundary; stress-strain curve; high strain rate;
D O I：
10.1016/S1359-6462(01)01071-5
中图分类号：
TB3 [工程材料学];
学科分类号：
0805 ; 080502 ;
摘要：
Uniaxial compression experiments for an electrodeposited nanostructured copper were performed at quasistatic strain rates of 4 x 10(-4) s(-1) and high strain rates of 3 x 10(3)-2 x 10(4) s(-1). The mechanical behavior of the no-Cu, including strength, strain hardening and strain-rate dependence of flow stress, is presented. (C) 2001 Acta Materialia Inc. Published by Elsevier Science Ltd. All rights reserved.
引用
收藏
页码：613 / 620
页数：8
相关论文
共 15 条
  • [1] [Anonymous], I PHYS C SER
  • [2] Interface controlled diffusional creep of nanocrystalline pure copper
    Cai, B
    Kong, QP
    Lu, L
    Lu, K
    [J]. SCRIPTA MATERIALIA, 1999, 41 (07) : 755 - 759
  • [3] Influence of strain rate & temperature on the mechanical response of ultrafine-grained Cu, Ni, AND Al-4Cu-0.5Zr
    Gray, GT
    Lowe, TC
    Cady, CM
    Valiev, RZ
    Aleksandrov, IV
    [J]. NANOSTRUCTURED MATERIALS, 1997, 9 (1-8): : 477 - 480
  • [4] Plastic deformation of nanocrystalline Cu and Cu-0.2 wt.% B
    Iyer, RS
    Frey, CA
    Sastry, SML
    Waller, BE
    Buhro, WE
    [J]. MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 1999, 264 (1-2): : 210 - 214
  • [5] Failure mode and dynamic behavior of nanophase iron under compression
    Jia, D
    Ramesh, KT
    Ma, E
    [J]. SCRIPTA MATERIALIA, 1999, 42 (01) : 73 - 78
  • [6] Ductility of nanostructured materials
    Koch, CC
    Morris, DG
    Lu, K
    Inoue, A
    [J]. MRS BULLETIN, 1999, 24 (02) : 54 - 58
  • [7] KOCH CC, 2000, TMS FALL M
  • [8] Microsample tensile testing of nanocrystalline metals
    Legros, M
    Elliott, BR
    Rittner, MN
    Weertman, JR
    Hemker, KJ
    [J]. PHILOSOPHICAL MAGAZINE A-PHYSICS OF CONDENSED MATTER STRUCTURE DEFECTS AND MECHANICAL PROPERTIES, 2000, 80 (04): : 1017 - 1026
  • [9] Superplastic extensibility of nanocrystalline copper at room temperature
    Lu, L
    Sui, ML
    Lu, K
    [J]. SCIENCE, 2000, 287 (5457) : 1463 - 1466
  • [10] Flow stress of FCC polycrystals with application to OFHC Cu
    Nemat-Nasser, S
    Li, YL
    [J]. ACTA MATERIALIA, 1998, 46 (02) : 565 - 577
12