Display driver packaging: ACF reaching the limits?

被引：11

作者：

Savolainen, P ^{[1
]}

机构：

[1] Nokia, Helsinki 00180, Finland

来源：

9TH INTERNATIONAL SYMPOSIUM ON ADVANCED PACKAGING MATERIALS: PROCESSES, PROPERTIES AND INTERFACES, 2004 PROCEEDINGS | 2004年

关键词：

D O I：

10.1109/ISAPM.2004.1287980

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

There is a clear trend to transform the mobile phone to a wireless terminal including a number of visual functions. Consequently, the terminal has developed from voice-mainly device to a multifunctional device, serving the users' various needs. A key building block for attractive, easy to use terminals is relatively large, high-resolution color display. The display development is trying to keep the pace with requirements, and one of the bottlenecks is how to package and connect the driving circuitry including the display driver, energy management, memory etc., to the display device. Technologies to integrate the circuitry to the glass substrate are under development, but current and coming mass production displays still need technologies to interconnect the driver electronics to the display. Anisotropic Conductive Film offers a solution to this challenge but how long?

引用

页码：7 / 10

页数：4