New Interferometric Approaches for Process and Product Quality Control

被引:0
作者
Gudelev, Valery
Smirnov, Andrey
Schreiber, Juergen [1 ,2 ]
机构
[1] Joint Insititute Nucl Res, Dubna, Russia
[2] Tech Univ Dresden, Dresden, Germany
关键词
Quality control;
D O I
10.3139/120.110076
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
We present two optical solutions being suitable for on-line fabrication control. The first technique is applicable to measure three dimensional profiles of microstructures at long working distance up to several tens of centimeters keeping the nanometer in-depth accuracy. The second is appropriate for the express space-resolved characterization of residual stress areas and microcracks in solar cell wafers.
引用
收藏
页码:652 / 658
页数:7
相关论文
共 6 条
  • [1] Crack detection and analyses using resonance ultrasonic vibrations in full-size crystalline silicon wafers
    Belyaev, A
    Polupan, O
    Dallas, W
    Ostapenko, S
    Hess, D
    Wohlgemuth, J
    [J]. APPLIED PHYSICS LETTERS, 2006, 88 (11)
  • [2] Measurement of residual stress in EFG ribbons using a phase-shifting IR photoelastic method
    Brito, MC
    Alves, JM
    Serra, JM
    Gamboa, RM
    Pinto, C
    Vallera, AM
    [J]. SOLAR ENERGY MATERIALS AND SOLAR CELLS, 2005, 87 (1-4) : 311 - 316
  • [3] HE S, 2005, RESIDUAL STRESSES PO
  • [4] JOHN W, NEW APPROACHES DRY E
  • [5] JU Y, 2002, P 6 FAR E C NOND TES, P535
  • [6] SMIRNOV AG, 2007, P SPIE, V6616