A measurement of Young's modulus and residual stress in MEMS bridges using a surface profiler

被引：40

作者：

Denhoff, MW ^{[1
]}

机构：

[1] Natl Res Council Canada, Inst Microstruct Sci, Ottawa, ON K1A 0R6, Canada

来源：

JOURNAL OF MICROMECHANICS AND MICROENGINEERING | 2003年 / 13卷 / 05期

关键词：

D O I：

10.1088/0960-1317/13/5/321

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper addresses a relatively simple method of measuring Young's modulus and residual stress in microelectromechanical system (MEMS) type structures. A surface profilometer is used to measure the deflection of thin film fixed-fixed beams due to the force applied by the profilometer probe. These measurements are analyzed using analytical beam theory. The treatment of end effects and the accuracy of the measurement are discussed. Measurements and results are presented for PECVD grown silicon nitride films.

引用

页码：686 / 692

页数：7

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