Development of RIE-textured silicon solar cells

被引:17
作者
Damiani, BM [1 ]
Lüdemann, R [1 ]
Ruby, DS [1 ]
Zaidi, SH [1 ]
Rohatgi, A [1 ]
机构
[1] Georgia Inst Technol, Atlanta, GA 30332 USA
来源
CONFERENCE RECORD OF THE TWENTY-EIGHTH IEEE PHOTOVOLTAIC SPECIALISTS CONFERENCE - 2000 | 2000年
关键词
D O I
10.1109/PVSC.2000.915843
中图分类号
TE [石油、天然气工业]; TK [能源与动力工程];
学科分类号
0807 ; 0820 ;
摘要
A maskless plasma texturing technique using Reactive Ion Etching for silicon solar cells results in a very low reflectance of 5.4 % before, and 3.9 % after SiN deposition. A detailed study of surface recombination and emitter properties was made, then solar cells were fabricated using the DOSS solar cell process. Different plasma-damage removal treatments are tested to optimize low lifetime solar cell efficiencies. Highest efficiencies are observed for little or no plasma-damage removal etching on mo-Si. Increased J(sc) due to the RIE texture proved superior to a single layer anti-reflection coating. This indicates that RIE texturing is a promising texturing technique, especially applicable on lower lifetime (multicrystalline) silicon. The use of non-toxic, non-corrosive SF6 makes this process attractive for mass production.
引用
收藏
页码:371 / 374
页数:4
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