Fabrication of feedthrough atom trapping chips for atomic optics

被引：0
|
作者：
Chuang, H. C. [1 ]
Hakala, T. K. [2 ,3 ]
Anderson, D. Z. [2 ]
Bright, V. M. [1 ]
机构：
[1] Univ Colorado, Dept Mech Engn, Boulder, CO 80309 USA
[2] Univ Colorado, Dept Phys, Boulder, CO USA
[3] Univ Jyvaskyla, Nanosci Ctr, Dept Phys, Jyvaskyla, Finland
来源：
TRANSDUCERS '07 & EUROSENSORS XXI, DIGEST OF TECHNICAL PAPERS, VOLS 1 AND 2 | 2007年
关键词：
atom chips; BEC; feedthrough; copper electroplating; BOSE-EINSTEIN CONDENSATION; GUIDING NEUTRAL ATOMS;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
We present a novel fabrication process for feedthrough atom trapping chips, which are used in atomic condensate optics. Copper electroplating is employed to vacuum seal the chip-through vias. The advantages of using feedthrough atom trapping chips are the simple microfabrication process and reduction of the overall chip area bonded to the glass atom trapping cell. The results demonstrate that current can be conducted through the vias while the vacuum can also be held under 1x10(-9) torr.
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页数：2
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