A figure of merit to characterize the efficacy of evaporation from porous microstructured surfaces

被引:16
作者
Bongarala, Manohar [1 ,2 ]
Hu, Han [3 ]
Weibel, Justin A. [1 ,2 ]
Garimella, Suresh, V [1 ,2 ,4 ]
机构
[1] Purdue Univ, Sch Mech Engn, W Lafayette, IN 47907 USA
[2] Purdue Univ, Birck Nanotechnol Ctr, W Lafayette, IN 47907 USA
[3] Univ Arkansas, Dept Mech Engn, Fayetteville, AR 72701 USA
[4] Univ Vermont, Burlington, VT 05405 USA
基金
美国国家科学基金会;
关键词
Thin-film evaporation; Structured surfaces; Microstructures; Thermal performance; Two-phase cooling; THIN-FILM EVAPORATION; HEAT-TRANSFER; WICKS; MODEL; SINK;
D O I
10.1016/j.ijheatmasstransfer.2021.121964
中图分类号
O414.1 [热力学];
学科分类号
摘要
Evaporation from porous structured surfaces is encountered in a variety of applications including electronics cooling, desalination, and solar energy generation. Of major interest in the design of thermal systems for such applications is a prediction of the heat and mass transfer rates during evaporation from these surfaces. The present study develops a figure of merit (FOM) that characterizes the efficacy of evaporative heat transfer from microstructured surfaces. Geometric quantities such as the contact line length per unit area, porosity, and contact angle that are independent of details of the surface structure are utilized to develop the FOM, allowing for flexibility in its application to a variety of structured surfaces. This metric is calibrated against an evaporative heat transfer model and further benchmarked with evaporation heat transfer data from the literature. The FOM successfully captures the variation in evaporation heat transfer coefficient across different structures as well as the optimum dimensions for a given structure, and therefore can serve as a tool to survey available structures and also optimize their dimensions for heat and mass transfer enhancement. (c) 2021 Elsevier Ltd. All rights reserved.
引用
收藏
页数:12
相关论文
共 33 条
  • [1] Design of micropillar wicks for thin-film evaporation
    Adera, Solomon
    Antao, Dion
    Raj, Rishi
    Wang, Evelyn N.
    [J]. INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 2016, 101 : 280 - 294
  • [2] Mathematical Modeling of Moving Contact Lines in Heat Transfer Applications
    Ajaev, V. S.
    Klentzman, J.
    Sodtke, C.
    Stephan, P.
    [J]. MICROGRAVITY SCIENCE AND TECHNOLOGY, 2007, 19 (3-4) : 23 - 26
  • [3] [Anonymous], 1953, A Theoretical Study of Interphase Mass Transfer, DOI DOI 10.7312/SCHR90162
  • [4] Superhydrophilic catenoidal aluminum micropost evaporator wicks
    Bang, Soosik
    Ryu, Seunggeol
    Ki, Seokkan
    Song, Kyounghwan
    Kim, Jinwook
    Kim, Joongnyon
    Nam, Youngsuk
    [J]. INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 2020, 158
  • [5] Evaporation analysis in sintered wick microstructures
    Bodla, Karthik K.
    Murthy, Jayathi Y.
    Garimella, Suresh V.
    [J]. INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 2013, 61 : 729 - 741
  • [6] Carey V.P., 2008, Liquid vapor phase change phenomena, V2nd
  • [7] Scaling up nanoscale water-driven energy conversion into evaporation-driven engines and generators
    Chen, Xi
    Goodnight, Davis
    Gao, Zhenghan
    Cavusoglu, Ahmet H.
    Sabharwal, Nina
    DeLay, Michael
    Driks, Adam
    Sahin, Ozgur
    [J]. NATURE COMMUNICATIONS, 2015, 6
  • [8] Novel two-phase jet impingement heat sink for active cooling of electronic devices
    de Oliveira, Pablo A.
    Barbosa, Jader R., Jr.
    [J]. APPLIED THERMAL ENGINEERING, 2017, 112 : 952 - 964
  • [9] Deryagin B., 1964, Kolloidn. Zh, V26, P301
  • [10] A hierarchical manifold microchannel heat sink array for high-heat-flux two-phase cooling of electronics
    Drummond, Kevin P.
    Back, Doosan
    Sinanis, Michael D.
    Janes, David B.
    Peroulis, Dimitrios
    Weibel, Justin A.
    Garimella, Suresh V.
    [J]. INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 2018, 117 : 319 - 330