Thermal Properties of Laser-Fabricated Copper-Carbon Composite Films on Polyimide Substrate

被引：6

作者：

Yao, Yu ^{[1
]}

Guo, Wei ^{[1
]}

Zhou, Xingwen ^{[1
]}

Peng, Peng ^{[2
]}

机构：

[1] Beihang Univ, Sch Mech Engn & Automat, Beijing 100191, Peoples R China

[2] Univ Waterloo, Dept Mech & Mechatron Engn, Ctr Adv Mat Joining, Waterloo, ON N2L 3G1, Canada

来源：

ADVANCED ENGINEERING MATERIALS | 2021年 / 23卷 / 12期

基金：

中国国家自然科学基金; 加拿大自然科学与工程研究理事会; 北京市自然科学基金;

关键词：

Cu-C thin films; direct laser writing; heat sink; thermal conductivity; POLYMER COMPOSITES; CONDUCTIVITY; GRAPHENE; OXIDATION; CARBONIZATION; NANOPARTICLES; STABILIZATION; SENSORS; FIBERS; LIGHT;

D O I：

10.1002/adem.202100623

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The growing demand for highly efficient heat management in flexible electronics requires fabrication of highly conductive flexible films. Herein, Cu-C film on a polyimide (PI) substrate is fabricated to form a layered Cu-C/PI composite conductive film using direct laser writing. Its oxidation resistance is significantly improved compared with the written Cu film due to the presence of a graphite shell on Cu particles in the Cu-C film. Furthermore, the Cu-C/PI composite film shows better thermal properties than Cu/PI. This work provides a one-step method for rapidly fabricating Cu/PI and Cu-C/PI composites with good thermal stability and conductivity.

引用

页数：8

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