Thermal Properties of Laser-Fabricated Copper-Carbon Composite Films on Polyimide Substrate

被引：6
作者：
Yao, Yu [1 ]
Guo, Wei [1 ]
Zhou, Xingwen [1 ]
Peng, Peng [2 ]
机构：
[1] Beihang Univ, Sch Mech Engn & Automat, Beijing 100191, Peoples R China
[2] Univ Waterloo, Dept Mech & Mechatron Engn, Ctr Adv Mat Joining, Waterloo, ON N2L 3G1, Canada
来源：
ADVANCED ENGINEERING MATERIALS | 2021年 / 23卷 / 12期
基金：
中国国家自然科学基金; 加拿大自然科学与工程研究理事会; 北京市自然科学基金;
关键词：
Cu-C thin films; direct laser writing; heat sink; thermal conductivity; POLYMER COMPOSITES; CONDUCTIVITY; GRAPHENE; OXIDATION; CARBONIZATION; NANOPARTICLES; STABILIZATION; SENSORS; FIBERS; LIGHT;
D O I：
10.1002/adem.202100623
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
The growing demand for highly efficient heat management in flexible electronics requires fabrication of highly conductive flexible films. Herein, Cu-C film on a polyimide (PI) substrate is fabricated to form a layered Cu-C/PI composite conductive film using direct laser writing. Its oxidation resistance is significantly improved compared with the written Cu film due to the presence of a graphite shell on Cu particles in the Cu-C film. Furthermore, the Cu-C/PI composite film shows better thermal properties than Cu/PI. This work provides a one-step method for rapidly fabricating Cu/PI and Cu-C/PI composites with good thermal stability and conductivity.
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页数：8
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