Failure Analysis of a Chip Carrier Board

被引：0

作者：

Fang, Xiaoyu ^{[1
]}

Dong, Yue ^{[1
]}

机构：

[1] UESTC, Sch Elect Sci & Engn, Chengdu, Sichuan, Peoples R China

来源：

2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) | 2018年

关键词：

chip carrier board; shedding; contaminants;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The author analyzes different micro areas of the chip carrier board with scanning electron microscope (SEM) and X-ray energy dispersive spectrometer(EDS) to find out the reasons why a type of chip is detached from the carrier board and the device does not work properly. The results show that the phenomenon of chip shedding due to the presence of contaminants between the chip and the carrier board.

引用

页码：97 / 99

页数：3