Compositional stability of hafnium aluminates thin films deposited on Si by atomic layer deposition

被引:10
作者
Driemeier, C
Bastos, KP
Miotti, L
Baumvol, IJR [1 ]
Nguyen, NV
Sayan, S
Krug, C
机构
[1] Univ Caxias Sul, CCET, BR-95070560 Caxias Do Sul, Brazil
[2] Univ Fed Rio Grande do Sul, BR-95070560 Caxias Do Sul, Brazil
[3] Univ Fed Rio Grande do Sul, Inst Fis, BR-91501970 Porto Alegre, RS, Brazil
[4] NIST, Div Semicond Elect, Gaithersburg, MD 20899 USA
[5] Rutgers State Univ, Dept Chem, Piscataway, NJ 08854 USA
[6] N Carolina State Univ, Dept Phys, Raleigh, NC 27695 USA
关键词
D O I
10.1063/1.1940130
中图分类号
O59 [应用物理学];
学科分类号
摘要
We have used nuclear reaction analyses and Rutherford backscattering spectrometry to investigate quantitatively the compositional stability of hafnium aluminate thin films deposited on Si(001) by atomic layer deposition using HfCl4/H2O and Al(CH3)(3)/H2O precursors. It was found that increasing Al/Hf deposition cycles ratio leads to increasing oxygen deficiency in the as-deposited films as well as to increasing metal losses (up to similar to 15%) from the films after rapid thermal annealing at 1000 degrees C. Furthermore, isotopic substitution experiments, showed that incorporation of oxygen from the gas phase is eased in the cases where deposition conditions failed to supply enough oxygen to complete oxides stoichiometry. (c) 2005 American Institute of Physics.
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页码:1 / 3
页数:3
相关论文
共 19 条
[1]   7ICROANALYSIS BY DIRECT OBSERVATION OF NUCLEAR REACTIONS USING A 2 MEV VAN-DE-GRAAFF [J].
AMSEL, G ;
NADAI, JP ;
DARTEMAR.E ;
DAVID, D ;
GIRARD, E ;
MOULIN, J .
NUCLEAR INSTRUMENTS & METHODS, 1971, 92 (04) :481-&
[2]   Atomic transport during growth of ultrathin dielectrics on silicon [J].
Baumvol, IJR .
SURFACE SCIENCE REPORTS, 1999, 36 (1-8) :1-166
[3]   Dielectric characteristics of Al2O3-HfO2 nanolaminates on Si(100) [J].
Cho, MH ;
Roh, YS ;
Whang, CN ;
Jeong, K ;
Choi, HJ ;
Nam, SW ;
Ko, DH ;
Lee, JH ;
Lee, NI ;
Fujihara, K .
APPLIED PHYSICS LETTERS, 2002, 81 (06) :1071-1073
[4]   Reaction-diffusion in high-k dielectrics on Si [J].
de Almeida, RMC ;
Baumvol, IJR .
SURFACE SCIENCE REPORTS, 2003, 49 (1-3) :1-114
[5]   USE OF THIN SI CRYSTALS IN BACKSCATTERING-CHANNELING STUDIES OF SI-SIO2 INTERFACE [J].
FELDMAN, LC ;
SILVERMAN, PJ ;
WILLIAMS, JS ;
JACKMAN, TE ;
STENSGAARD, I .
PHYSICAL REVIEW LETTERS, 1978, 41 (20) :1396-1399
[6]   Enhanced initial growth of atomic-layer-deposited metal oxides on hydrogen-terminated silicon [J].
Frank, MM ;
Chabal, YJ ;
Green, ML ;
Delabie, A ;
Brijs, B ;
Wilk, GD ;
Ho, MY ;
da Rosa, EBO ;
Baumvol, IJR ;
Stedile, FC .
APPLIED PHYSICS LETTERS, 2003, 83 (04) :740-742
[7]   Study of thin hafnium oxides deposited by atomic layer deposition [J].
Ganem, JJ ;
Trimaille, I ;
Vickridge, IC ;
Blin, D ;
Martin, F .
NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH SECTION B-BEAM INTERACTIONS WITH MATERIALS AND ATOMS, 2004, 219 :856-861
[8]   Compatibility of polycrystalline silicon gate deposition with HfO2 and Al2O3/HfO2 gate dielectrics [J].
Gilmer, DC ;
Hegde, R ;
Cotton, R ;
Garcia, R ;
Dhandapani, V ;
Triyoso, D ;
Roan, D ;
Franke, A ;
Rai, R ;
Prabhu, L ;
Hobbs, C ;
Grant, JM ;
La, L ;
Samavedam, S ;
Taylor, B ;
Tseng, H ;
Tobin, P .
APPLIED PHYSICS LETTERS, 2002, 81 (07) :1288-1290
[9]   High-resolution depth profiling in ultrathin Al2O3 films on Si [J].
Gusev, EP ;
Copel, M ;
Cartier, E ;
Baumvol, IJR ;
Krug, C ;
Gribelyuk, MA .
APPLIED PHYSICS LETTERS, 2000, 76 (02) :176-178
[10]   Suppressed crystallization of Hf-based gate dielectrics by controlled addition of Al2O3 using atomic layer deposition [J].
Ho, MY ;
Gong, H ;
Wilk, GD ;
Busch, BW ;
Green, ML ;
Lin, WH ;
See, A ;
Lahiri, SK ;
Loomans, ME ;
Räisänen, PI ;
Gustafsson, T .
APPLIED PHYSICS LETTERS, 2002, 81 (22) :4218-4220