Effect of Nanoparticles on the Performance of Thermally Conductive Epoxy Adhesives

被引:95
作者
Fu, Jifang [1 ,2 ]
Shi, Liyi [1 ,2 ]
Zhang, Dengsong [1 ,2 ]
Zhong, Qingdong [1 ,2 ]
Chen, Yi [1 ,2 ]
机构
[1] Shanghai Univ, Sch Mat Sci & Engn, Shanghai 200072, Peoples R China
[2] Shanghai Univ, Res Ctr Nanosci & Nanotechnol, Shanghai 200444, Peoples R China
关键词
POLYMER NANOCOMPOSITES; MOLDING COMPOUND; COMPOSITES; NITRIDE; MECHANISMS;
D O I
10.1002/pen.21705
中图分类号
TQ [化学工业];
学科分类号
0817 ;
摘要
Microsized or nanosized alpha-alumina (Al2O3) and boron nitride (BN) were effectively treated by silanes or diisocyanate, and then filled into the epoxy to prepare thermally conductive adhesives. The effects of surface modification and particle size on the performance of thermally conductive epoxy adhesives were investigated. It was revealed that epoxy adhesives filled with nanosized particles performed higher thermal conductivity, electrical insulation, and mechanical strength than those filled with microsized ones. It was also indicated that surface modification of the particles was beneficial for improving thermal conductivity of the epoxy composites, which was due to the decrease of thermal contact resistance of the filler-matrix through the improvement of the interface between filler and matrix by surface treatment. A synergic effect was found when epoxy adhesives were filled with combination of Al2O3 nanoparticles and microsized BN platelets, that is, the thermal conductivity was higher than that of any sole particles filled epoxy composites at a constant loading content. The heat conductive mechanism was proposed that conductive networks easily formed among nano-Al2O3 particles and micro-BN platelets and the thermal resistance decreased due to the contact between the nano-Al2O3 and BN, which resulted in improving the thermal conductivity. POLYM. ENG. SCI., 50:1809-1819, 2010. (C) 2010 Society of Plastics Engineers
引用
收藏
页码:1809 / 1819
页数:11
相关论文
共 38 条
[1]  
BALABANOVICH AI, 1998, FIRE RETARDANCY POLY, P236
[2]   Fabrication and mechanical characterization of carbon/SiC-epoxy nanocomposites [J].
Chisholm, N ;
Mahfuz, H ;
Rangari, VK ;
Ashfaq, A ;
Jeelani, S .
COMPOSITE STRUCTURES, 2005, 67 (01) :115-124
[3]  
DENOYO AB, 1999, AMKOR ANAM PHILIPINE, P201
[4]  
Ekstrand L, 2005, INT SPR SEM ELECT TE, P19
[5]   CRACK DEFLECTION PROCESSES .1. THEORY [J].
FABER, KT ;
EVANS, AG .
ACTA METALLURGICA, 1983, 31 (04) :565-576
[6]   Effects of nano-sized particles on electrical and thermal conductivities of polymer composites [J].
Fan, LH ;
Su, B ;
Qu, JM ;
Wong, CP .
9TH INTERNATIONAL SYMPOSIUM ON ADVANCED PACKAGING MATERIALS: PROCESSES, PROPERTIES AND INTERFACES, 2004 PROCEEDINGS, 2004, :193-199
[7]  
FEHR S, 1997, ADV PACKAGING, P44
[8]   Evaluation and identification of electrical and thermal conduction mechanisms in carbon nanotube/epoxy composites [J].
Gojny, FH ;
Wichmann, MHG ;
Fiedler, B ;
Kinloch, IA ;
Bauhofer, W ;
Windle, AH ;
Schulte, K .
POLYMER, 2006, 47 (06) :2036-2045
[9]   High thermal conductivity epoxy molding compound filled with a combustion synthesized AIN powder [J].
Hsieh, Cheng-Yu ;
Chung, Shyan-Lung .
JOURNAL OF APPLIED POLYMER SCIENCE, 2006, 102 (05) :4734-4740
[10]   Development of conducting adhesive materials for microelectronic applications [J].
Kang, SK ;
Purushothaman, S .
JOURNAL OF ELECTRONIC MATERIALS, 1999, 28 (11) :1314-1318