Developing and benchmarking lead-free processes

被引：0

作者：

Rae, A ^{[1
]}

Lasky, R ^{[1
]}

Belmonte, J ^{[1
]}

McLenaghan, J ^{[1
]}

Gosselin, D ^{[1
]}

机构：

[1] Cookson Elect Inc, Foxborough, MA 02035 USA

来源：

2000 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS | 2000年 / 4339卷

关键词：

lead-free; assembly; process; solder;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Lead-free processing has become a certainty in some parts of the electronics industry. It is now up to us to deliver appropriate process solutions delivering performance products reproducibly at an acceptable cost. Now that the industry has started to settle on standard lead-free assembly alloys, one layer of complication has been removed but now the issue of process precision becomes paramount. How to control yields? How to control throughput? How to measure and benchmark performance? How to maximize performance? How to generate profit? Cookson Performance Solutions has been set up to tackle issues such as these using real-world materials and equipment In their new facility in Foxborough, MA. This paper outlines some of the key technical and economic issues that have arisen and the interim results of the lead-free process project. Issues discussed include marker timing, costing of lead-free processing, laminate selection, surface treatment, component selection, alloy selection and limitations. reflow and wave processing, cleaning and recycling.

引用

页码：605 / 610

页数：6