Molecular dynamics study of a nano-particle joint for potential lead-free anisotropic conductive adhesives applications

被引：3

作者：

Dong, H ^{[1
]}

Zhang, ZQ ^{[1
]}

Wong, CP ^{[1
]}

机构：

[1] Georgia Inst Technol, Sch Mat Sci & Engn, Atlanta, GA 30332 USA

来源：

JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY | 2005年 / 19卷 / 02期

关键词：

computer simulation; molecular dynamics; embedded atom method; conductive adhesive;

D O I：

10.1163/1568561053148430

中图分类号：

TQ [化学工业];

学科分类号：

0817 ;

摘要：

Molecular dynamics (MD) simulation was performed to simulate the application of an anisotropic conductive adhesive (ACA). The dynamics of a copper sphere (radius 2 nm) between two copper substrates was investigated, using the embedded atom method (EAM). The structure evolution of the sphere was analyzed by x-z plane projection, pair-correlation function, and potential energy curve. x-z plane projection and potential energy curve showed that with applied strain the copper sphere went through an order-disorder-order type of phase transition. Pair-correlation function results showed a more ordered sphere structure with applied compressive strain as compared to the simulation without strain.

引用

页码：87 / 94

页数：8

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