Low-temperature wafer bonding for MEMS packaging utilizing screen-printed sub-micron size Au particle patterns

被引：1

作者：

Ishizuka, S. ^{[1
]}

Akiyama, N. ^{[2
]}

Ogashiwa, T. ^{[2
]}

Nishimori, T. ^{[2
]}

Ishida, H. ^{[3
]}

Shoji, S. ^{[1
]}

Mizuno, J. ^{[4
]}

机构：

[1] Waseda Univ, Tokyo 1698555, Japan

[2] Tanaka Kikinzoku Kogyo KK, Hiratsuka, Kanagawa 2540076, Japan

[3] SUSS MicroTec KK, Yokohama, Kanagawa 2260006, Japan

[4] Waseda Univ, Nanotechnol Res Lab, Tokyo 1620041, Japan

来源：

MICROELECTRONIC ENGINEERING | 2011年 / 88卷 / 08期

关键词：

Wafer bonding; MEMS; Screen printing; Au bonding;

D O I：

10.1016/j.mee.2011.02.083

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

In this study, a new wafer bonding method for MEMS (micro electro mechanical systems) packaging is presented. The seal lines of sub-micron size Au particles with a width of 50 mu m were formed on wafers by means of screen-printing. The bonding process was carried out at 300 degrees C under reduced pressure, 1 x 10(-3) mbar. The bonded wafers were diced into 5 mm x 5 mm individual chips. The bond strength of each chips was about 20 MPa measured by a tensile test and about 40 MPa by a shear test in the average. It was confirmed that two wafers were successfully bonded with screen-printed Au particle seal lines. The proposed method can be applied to practical MEMS packaging. (C) 2011 Elsevier B.V. All rights reserved.

引用

页码：2275 / 2277

页数：3

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