Microstructural Development in a Ternary Al-Cu-Si Alloy during Transient Solidification

被引:9
作者
Ferreira, I. L. [1 ,2 ,4 ]
Moutinho, D. J. [3 ]
Gomes, L. G. [3 ]
Rocha, O. L. [3 ]
Goulart, P. R. [4 ]
Garcia, A. [4 ]
机构
[1] Univ Fed Fluminense, Dept Mech Engn, Av Trabalhadores 420, BR-27255125 Volta Redonda, RJ, Brazil
[2] IFPA, Belem, Para 66093020, Brazil
[3] IFPA, Federal Inst Educ Sci & Technol, BR-66093 Belem, Para, Brazil
[4] Univ Campinas UNICAMP, Dept Mat Engn, BR-13083970 Campinas, SP, Brazil
来源
ADVANCED MATERIALS FORUM V, PT 1 AND 2 | 2010年 / 636-637卷
基金
巴西圣保罗研究基金会;
关键词
Solidification; Microstructure; Numerical model; DIRECTIONAL SOLIDIFICATION; NUMERICAL SCHEME; METAL-ALLOYS; SN ALLOYS; GROWTH; PB; PREDICTIONS; PARAMETERS; SPACINGS; MODEL;
D O I
10.4028/www.scientific.net/MSF.636-637.643
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Macrosegregation and microporosity formation numerical models are dependent on microstructural parameters, such as primary and secondary arm spacings to provide the permeability coefficient in the mushy zone. As can be observed in the literature, growth models for ternary alloys for unsteady solidification are rarely found. In this paper, the primary (lambda(1)) dendrite arm spacing was measured along the length of an Al-Cu-Si alloy casting and correlated with transient solidification thermal variables. A combined theoretical and experimental approach has been carried out to quantitatively determine such thermal variables, i.e., transient metal/mold heat transfer coefficient, liquidus isotherm velocity and cooling rate ahead the liquidus front.
引用
收藏
页码:643 / +
页数:3
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