Microstructural Development in a Ternary Al-Cu-Si Alloy during Transient Solidification

被引：9

作者：

Ferreira, I. L. ^{[1
,2
,4
]}

Moutinho, D. J. ^{[3
]}

Gomes, L. G. ^{[3
]}

Rocha, O. L. ^{[3
]}

Goulart, P. R. ^{[4
]}

Garcia, A. ^{[4
]}

机构：

[1] Univ Fed Fluminense, Dept Mech Engn, Av Trabalhadores 420, BR-27255125 Volta Redonda, RJ, Brazil

[2] IFPA, Belem, Para 66093020, Brazil

[3] IFPA, Federal Inst Educ Sci & Technol, BR-66093 Belem, Para, Brazil

[4] Univ Campinas UNICAMP, Dept Mat Engn, BR-13083970 Campinas, SP, Brazil

来源：

ADVANCED MATERIALS FORUM V, PT 1 AND 2 | 2010年 / 636-637卷

基金：

巴西圣保罗研究基金会;

关键词：

Solidification; Microstructure; Numerical model; DIRECTIONAL SOLIDIFICATION; NUMERICAL SCHEME; METAL-ALLOYS; SN ALLOYS; GROWTH; PB; PREDICTIONS; PARAMETERS; SPACINGS; MODEL;

D O I：

10.4028/www.scientific.net/MSF.636-637.643

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Macrosegregation and microporosity formation numerical models are dependent on microstructural parameters, such as primary and secondary arm spacings to provide the permeability coefficient in the mushy zone. As can be observed in the literature, growth models for ternary alloys for unsteady solidification are rarely found. In this paper, the primary (lambda(1)) dendrite arm spacing was measured along the length of an Al-Cu-Si alloy casting and correlated with transient solidification thermal variables. A combined theoretical and experimental approach has been carried out to quantitatively determine such thermal variables, i.e., transient metal/mold heat transfer coefficient, liquidus isotherm velocity and cooling rate ahead the liquidus front.

引用

页码：643 / +

页数：3

共 50 条

[1] Solidification and microstructural formation of a ternary eutectic Al-Cu-Si cast alloy
Awe S.A.
Journal of King Saud University - Engineering Sciences, 2021, 33 (08) : 569 - 580
[2] Thermal Parameters, Microstructure and Porosity During Transient Solidification of Ternary Al-Cu-Si Alloys
Moutinho, Daniel J.
Gomes, Laercio G.
Rocha, Otavio L.
Ferreira, Ivaldo L.
Garcia, Amauri
ADVANCED MATERIALS FORUM VI, PTS 1 AND 2, 2013, 730-732 : 883 - +
[3] Microstructures observed during directional solidification along the univariant eutectic reaction in a ternary Al-Cu-Si alloy
de Wilde, J
Froyen, L
SOLIDIFICATION AND GRAVITY IV, 2006, 508 : 51 - 56
[4] Modeling thermal behavior of chills during solidification of Al-Cu-Si alloy
Prabhu, KN
Prabhu, NN
TRANSACTIONS OF THE AMERICAN FOUNDRYMEN'S SOCIETY, VOL 105, 1998, 105 : 707 - 713
[5] Microstructural evolution in rapidly solidified Al-Cu-Si ternary alloys
K. P. Cooper
H. N. Jones
Journal of Materials Science, 2001, 36 : 5315 - 5323
[6] Morphology and Phase Formation During the Solidification of Al-Cu-Si and Al-Ag-Cu Ternary Eutectic Systems
Morando, Carina
Fornaro, Osvaldo
MATERIALS RESEARCH-IBERO-AMERICAN JOURNAL OF MATERIALS, 2018, 21 (02):
[7] Microstructural evolution in rapidly solidified Al-Cu-Si ternary alloys
Cooper, KP
Jones, HN
JOURNAL OF MATERIALS SCIENCE, 2001, 36 (22) : 5315 - 5323
[8] Microstructure and Tensile Properties of Al-Cu-Si Alloy with Different Solidification Pressures
Ouyang, X. X.
Zhao, H. D.
Zhang, K. W.
Li, Y. Y.
ADVANCES IN MATERIALS MANUFACTURING SCIENCE AND TECHNOLOGY XIII, VOL II: MODERN DESIGN THEORY AND METHODOLOGY, MEMS AND NANOTECHNOLOGY, AND MATERIAL SCIENCE AND TECHNOLOGY IN MANUFACTURING, 2009, 628-629 : 593 - 598
[9] Microstructural development during transient directional solidification of a hypomonotectic Al-In alloy
Silva, Adrina P.
Goulart, Pedro R.
Garcia, Amauri
Spinelli, Jose E.
PHILOSOPHICAL MAGAZINE LETTERS, 2012, 92 (09) : 442 - 450
[10] Numerical and experimental investigation of microporosity formation in a ternary Al-Cu-Si alloy
Ferreira, Ivaldo L.
Lins, Jefferson F. C.
Moutinho, Daniel J.
Gomes, Laercio G.
Garcia, Amauri
JOURNAL OF ALLOYS AND COMPOUNDS, 2010, 503 (01) : 31 - 39

← 1 2 3 4 5 →