Phase Array Ultrasonic Transducer Based on a Flip Chip Bonding with Indium Solder Bump

被引：4

作者：

Lee, Jaehoon ^{[1
]}

Kim, Eun Sok ^{[1
]}

机构：

[1] Univ Southern Calif, Dept Elect & Comp Engn, Los Angeles, CA 90089 USA

来源：

INTERNATIONAL ULTRASONICS SYMPOSIUM (IEEE IUS 2021) | 2021年

关键词：

Phase array ultrasonic transducer; Focused ultrasound; Flip chip bonding; Indium bump; Formic acid;

D O I：

10.1109/IUS52206.2021.9593776

中图分类号：

O42 [声学];

学科分类号：

070206 ; 082403 ;

摘要：

This paper presents the design, simulation and fabrication process of a phase array ultrasonic transducer based on 1mm-thick lead zirconate titanate (PZT) substrate with 128 independently accessible electrodes through flip chip bonding with indium solder bump. The reflow processes of indium have been explored under air, nitrogen, hydrogen, liquid metal flux, and formic acid (H2CO2). Among these, formic acid is found to be the best ambient for forming indium bump, as it removes indium oxide and clean out residuals most effectively. Also, different sizes of under bump metallization (UBM) and indium pattern have been tested, and the measured heights of indium bumps after a reflow show that the lateral dimension ratio of 1:2.5 between the UBM and indium patterns offers the best wettability over the UBM with the smallest residual.

引用

页数：4

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