Fast and Accurate Frequency-Dependent Behavioral Model of Bonding Wires

被引:11
|
作者
Wang, To-Po [1 ]
Lu, You-Fu [2 ]
机构
[1] Natl Taipei Univ Technol, Elect Engn, Taipei 10608, Taiwan
[2] Etron Technol Inc, Hsinchu 300, Taiwan
关键词
Bonding wires; frequency-dependent; IN-SITU MEASUREMENT; ON-CHIP; BONDWIRE INDUCTORS; EMI SIMULATIONS; MICROWAVE; RF; TRANSFORMERS; DESIGN;
D O I
10.1109/TII.2017.2737525
中图分类号
TP [自动化技术、计算机技术];
学科分类号
0812 ;
摘要
A proposed model of bonding wires is presented in this paper. For a regular double-p bonding-wire model considering the skin effect, nine parameters should be determined, including inductance (L-S), series parasitic resistances (R-1, R-2), shunt parasitic capacitances (C-PAR1, C-PAR2), and parameters for skin effects (R-S1, L-S1, R-S2, L-S2), so procedures to extract the design parameters for a bonding-wire model are complicated. To reduce the complexity, a proposed model is presented. Introducing a frequency-dependent resistor R(skin)f(m) can significantly reduce the number of design parameters for a bonding-wire model considering the skin effect from nine to five. This can resolve the design complexity of the bonding wires and cables. Moreover, it is suitable for industrial applications. In addition, the proposed design methodology is presented and the mechanisms are validated by experiments. According to experimental results, the model accuracy with 10% difference in magnitude between measured and modeled S-21 of the 2, 4, 6, and 8 mm aluminum bonding wires is at the frequencies of 5.9, 5.0, 3.5, and 2.9 GHz, respectively.
引用
收藏
页码:2389 / 2396
页数:8
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