Reflection Seismic Interferometry via Higher-Order Cumulants to Solve Normal Moveout Stretch

被引:2
|
作者
Liang, Shanglin [1 ]
Hu, Tianyue [1 ]
Qiao, Baoping [2 ]
Cui, Dong [3 ]
机构
[1] Peking Univ, Sch Earth & Space Sci, Beijing 100871, Peoples R China
[2] Beijing Res Inst Uranium Geol, Beijing 100029, Peoples R China
[3] PetroChina, Res Inst Petr Explorat & Dev, Beijing 100083, Peoples R China
基金
中国国家自然科学基金;
关键词
MOS devices; Reflection; Interferometry; Signal to noise ratio; Stacking; Correlation; Noise reduction; Higher-order cumulant (HOC); normal moveout (NMO) correction; signal enhancement; stretching distortion; GENERALIZED NONHYPERBOLIC MOVEOUT; TRANSFORM;
D O I
10.1109/LGRS.2021.3131208
中图分类号
P3 [地球物理学]; P59 [地球化学];
学科分类号
0708 ; 070902 ;
摘要
Normal moveout (NMO) correction is an important step in seismic data processing. Conventional NMO methods, however, suffer from serious stretching distortions, especially at the shallow layer and far-offset traces. These distortions are not conducive to subsequent data processing at all. Reflection seismic interferometry, the cores of which are cross-correlation and stacking, is the latest technology to achieve noise suppression and signal enhancement. Compared with cross-correlation, higher-order cumulants (HOCs) have a better performance of time delay estimation and signal enhancement. To fully exploit its advantages, we propose reflection seismic interferometry based on HOC instead of cross-correlation to solve NMO stretching in this letter. Our proposed method is first tested on synthetic examples and then applied to field data from eastern China. The corresponding results demonstrate that the proposed data-driven method, without the need for velocity information, not only solves the far-offset traces' stretching distortions of NMO correction, but also has a better noise suppression effect compared with the other two existing methods. These advancements are important to improve the resolution of seismic data and increase amplitude fidelity.
引用
收藏
页数:5
相关论文
共 50 条
  • [31] FIR system identification based on higher-order cyclic cumulants
    Chen, BN
    Zhang, XD
    ISCAS '97 - PROCEEDINGS OF 1997 IEEE INTERNATIONAL SYMPOSIUM ON CIRCUITS AND SYSTEMS, VOLS I - IV: CIRCUITS AND SYSTEMS IN THE INFORMATION AGE, 1997, : 2437 - 2440
  • [32] Higher-order cumulants based maneuver detection in Kalman filter
    Ji, HB
    Song, LP
    Gao, XB
    2002 IEEE REGION 10 CONFERENCE ON COMPUTERS, COMMUNICATIONS, CONTROL AND POWER ENGINEERING, VOLS I-III, PROCEEDINGS, 2002, : 1385 - 1388
  • [33] Magnitude and significance of the higher-order reduced density matrix cumulants
    Herbert, John M.
    INTERNATIONAL JOURNAL OF QUANTUM CHEMISTRY, 2007, 107 (03) : 703 - 711
  • [34] Causal Discovery with Latent Confounders Based on Higher-Order Cumulants
    Cai, Ruichu
    Huang, Zhiyi
    Chen, Wei
    Hao, Zhifeng
    Zhang, Kun
    INTERNATIONAL CONFERENCE ON MACHINE LEARNING, VOL 202, 2023, 202
  • [35] Blind identification and deconvolution algorithms using higher-order cumulants
    Ueng, FB
    Su, YT
    JOURNAL OF THE CHINESE INSTITUTE OF ENGINEERS, 1997, 20 (03) : 247 - 255
  • [36] Normal Higher-Order Termination
    Jouannaud, Jean-Pierre
    Rubio, Albert
    ACM TRANSACTIONS ON COMPUTATIONAL LOGIC, 2015, 16 (02)
  • [37] Higher-order time-delay interferometry
    Tinto, Massimo
    Dhurandhar, Sanjeev
    PHYSICAL REVIEW D, 2023, 108 (08)
  • [38] Accurate elevation and normal moveout corrections of seismic reflection data on rugged topography
    Liu, JP
    Xia, JH
    Chen, C
    Zhang, G
    NEW ZEALAND JOURNAL OF GEOLOGY AND GEOPHYSICS, 2005, 48 (04) : 707 - 716
  • [39] HIGHER-ORDER EFFICIENCY CONDITIONS VIA HIGHER-ORDER TANGENT CONES
    Do Van Luu
    NUMERICAL FUNCTIONAL ANALYSIS AND OPTIMIZATION, 2014, 35 (01) : 68 - 84
  • [40] Automatic Classification of Power Quality Disturbances via Higher-Order Cumulants and Self-Organizing Networks
    Jose Gonzalez de la Rosa, Juan
    Moreno-Munoz, Antonio
    Palomares, Jose Carlos
    Agueera, Agustin
    IEEE INTERNATIONAL SYMPOSIUM ON INDUSTRIAL ELECTRONICS (ISIE 2010), 2010, : 1579 - 1584